Agilent Technologies' BSIM3 Model Extraction Package for CMOS Modeling Foundries Now Available
April 20, 2007 -- Agilent Technologies, Inc. has announced shipment of the enhanced BSIM3 Model Extraction Package for use with Agilent's IC Characterization and Analysis Program (IC-CAP) device modeling software. The new BSIM3 package contains the same speed and efficiency featured in the newer BSIM4 and PSP extraction modules and can also reduce CMOS device model extraction times from weeks to days.
IC-CAP software is a modeling software tool with a comprehensive extraction methodology for all three of the standard CMOS device models: BSIM3, BSIM4 and PSP. Although the more advanced BSIM4 and PSP CMOS models are used today for sub-micron MOS processes, the simpler BSIM3 model is still widely used for large-volume and less-advanced MOS applications.
The new BSIM3 package completes a comprehensive Agilent suite of CMOS modeling solutions that includes the BSIM4 and the most recent PSP Modeling Extraction Packages. It includes an extraction technology that employs physical-based extraction steps rather than time-consuming and unreliable manual tuning. With the BSIM3 package modelers can characterize a full CMOS process in just two days, down from an average industry time of 10 days. The BSIM3 package also uses a variety of advanced graphical and analysis tools to boost efficiency. Customizable architecture allows the user to optimize the extraction flow for a specific process to achieve maximum efficiency and accuracy during subsequent extractions.
Pricing and Availability
The Agilent BSIM3 Model Extraction Package is available now as a downloadable update to the current IC-CAP 2006B release, with prices starting at approximately $22,000.
Reprinted from SOCcentral.com, your first stop for ASIC, FPGA, EDA, and IP news and design information.