CSR and TSMC Collaboration Reaches New Milestones
October 30, 2009 -- CSR plc today announced that it has shipped more than 1.5 billion units and processed more than one million wafers from foundry partner . CSR also announced that it is collaborating with TSMC on a leading edge 40-nm low-power (LP) RF process technology and that CSR has validated a broad range of proprietary connectivity IP blocks at this node for incorporation into its next generation Connectivity Centre SOCs.
CSR's Connectivity Centre SOCs require a small form factor and lower power consumption to deliver seamless connectivity for next-generation wireless devices. TSMC's 40-nm LP RF process technology enables CSR to meet these objectives with highly integrated multi radio devices that allow the seamless coexistence of Bluetooth, GPS, Wi-Fi and FM radios. The two companies are leveraging their long relationship to help CSR achieve 40-nm leadership with its multifunction radio integrated silicon platforms.
Reprinted from SOCcentral.com, your first stop for ASIC, FPGA, EDA, and IP news and design information.