Toshiba Selects SonicsSX for Next-Generation Product Development
June 18, 2012 -- Sonics, Inc. today announced a collaboration with Toshiba Corp. Semiconductor & Storage Products Company for next-generation product development in embedded multimedia and automotive SOC designs. Toshiba has introduced a low-power, many-core SOC for multimedia applications that will be implemented in 40-nm CMOS technology. Within a 209.3-mm˛ die, two 32-core clusters are integrated with dynamically reconfigurable processors, hardware accelerators, 2-channel DDR3 I/Fs, and other peripherals. The high scalability and low power consumption is accomplished by the parallelized firmware for multimedia applications, such as the full-HD H.264 decoding and the 4K2K super resolution in less than 1W.
As part of the SOC design project, SonicsSX was specifically used as a high-performance on-chip network for connection between the many-core clusters and other modules. Sonics' solution was used to manage the high traffic flows between the sub-modules and enable Toshiba to build a large, complex SOC in an extremely short timeframe.
SonicsSX is one of Sonics' highest-performance products with up to 16-GBps bandwidth per port, and is ideal for achieving the data throughput requirements for today's advanced SOCs. SonicsSX contains a high-performance fabric and comprehensive set of data-flow services for the development of complex, multi-core and multi-subsystem SOCs, and can ideally serve as a local subsystem or global on-chip network solution.
Reprinted from SOCcentral.com, your first stop for ASIC, FPGA, EDA, and IP news and design information.