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 Category: Special Topics: Floorplanning & Layout: Friday, September 10, 2010

Featured Articles

Hard Macro Placement in Complex SoC Design

Advanced process nodes enable the implementation of highly complex system on chips (SoCs) and multimillion-gate designs such as memories, processor cores, analog circuitry, DSP cores, and PLLs. For these large, complex designs, designers are using more hard macros to help speed logic-gate placement and to alleviate some tool-capacity challenges. Most of the logic gates - and, therefore, most hard macros used to place these gates - are dedicated to memories.

To succeed in their role, physical designers must deliver a competitive product “right” to market: the right features and functionality at the right time and cost. This means that the die size (area) cannot be too large, the design cost must remain within the range of profitability, the design must operate at its target frequency, and the entire design — from concept to silicon — must be delivered on time. As a result, accurate hard macro placement can make the difference between a design success and a design failure, and is becoming mission-critical to SoC design.

In this article, we look at the challenges — and solution — to accurate hard macro placement.

Read the entire Synopsys, Inc. article on SOCcentral.

Moore’s Law and the Need for a Revolution in Floorplanning Methodology

Now, with Moore's Law racing forward at an accelerated pace, increasing transistor counts, emerging design challenges and sophisticated analysis requirements are making it difficult to meet performance and time-to-market goals. This article will describe problems with current approaches to floorplanning and why a revolutionary approach to floorplanning must take place if we are to continue to maintain and grow the rate of design starts and meet available fabrication capacity.

Read the entire Magma Design Automation, Inc. article on SOCcentral.

It’s All About the Routing, Stupid!

It’s no secret that the task of designing and manufacturing today’s extremely complex multi-million gate ASICs and SoCs is becoming increasingly problematical. The message is taking hold that the design community can no longer ignore the issues of yield and manufacturability. The question in the industry has evolved from "why should my design team worry about manufacturability and yield?" to "what should my design team do about manufacturability and yield and where should I start?"

Unfortunately for the designer, the industry has not yet provided a magic "knob" that designers can turn to adjust the yield of their designs. Most SoC designers have three main things they can control: the architecture of the design, the choice of building blocks they use to create the design, and the routing that hooks everything together.

Read the entire Pyxis Technology, Inc. article on SOCcentral.

Designer's Mall

SOCcentral news items about Floorplanning & Layout

Cadence Delivers TLM-Driven Design and Verification, 3D-IC Design and Integrated DFM Capabilities to TSMC Reference Flow 11.0 (6/14/2010)
Xilinx ISE Design Suite 12 Enables Up to 30% Dynamic Power Reduction with Intelligent Clock-Gating Technology (5/3/2010)
CSR Adopts Ciranova Helix and PyCells for Mixed-Signal SOC Design (4/6/2010)
Parallel Engines Licenses Verific Verilog Parser Serves as Front End to Next-Generation Floorplanner (3/31/2010)
Design Compiler 2010 Doubles Productivity of Synthesis and Place-and-Route (3/29/2010)
Parallel Engines Focuses on Merging of EDA and Semiconductor/ IP Integration (3/16/2010)
ATopTech's Aprisa Physical Design Solution Qualified by TSMC for 40-nm Designs (1/19/2010)
AppliedMicro Standardizes on Cadence Encounter Digital Implementation System (12/10/2009)
Denali Announces State-of-the-Art Gigahertz DDR PHY Technology (12/10/2009)
X-FAB Launches Third-Party IP and Design Partner Network to Link Customers with Optimal Resources (12/8/2009)
Magma Releases Hydra 1.1 Enhanced Hierarchical Design-Planning Solution (11/19/2009)
Exar Selects Cadence as Mixed-Signal EDA Provider (11/5/2009)

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Magazine & Journal articles on Floorplanning & Layout

Accelerate Design Closure with Multi-Core Timing Analysis and Optimization SOCcentral (11/2/2009)
Layout Automation for the Next Generation of Custom Chips SOCcentral (7/6/2009)
Challenges in 45-nm Physical Design SOCcentral (11/6/2008)
Floorplanning a Power Delivery Network with Spice Electronic Design Magazine (7/24/2008)
How Floorplanning Guides Synthesis and Physical Design SCDsource (5/6/2008)
What Floorplan Information Is Needed for Synthesis EDA DesignLine (4/22/2008)
Power Integrity and Energy-Aware Floorplanning SOCcentral (1/16/2008)
PDF CEO Calls for Restricted Layouts SCDsource (11/12/2007)
Using Dynamic and Static Power Rail Analysis to Maximize Results with Minimum Effort SOCcentral (6/26/2006)
Seven Habits of Effective Formal Verification Planning SOCcentral (6/12/2006)
I/O Planning Ensures IC Packaging Success eeDesign (EE Times EDA News) (1/30/2006)
Hard Macro Placement in Complex SoC Design SOCcentral (11/18/2005)
The Evolution of FPGA Physical Synthesis SOCcentral (11/5/2005)
Graph-Based Physical Synthesis for FPGAs SOCcentral (10/17/2005)
Moore’s Law and the Need for a Revolution in Floorplanning Methodology SOCcentral (10/17/2005)
Design-Planning Guidelines Prevent Chip Surprises EDN Magazine (2/5/2004)
Exploring New Design Flows (Part 3): RTL Synthesis eeDesign (EE Times EDA News) (3/7/2002)

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Tutorials, White Papers and Conference Papers on Floorplanning & Layout

A Method for Correcting the Functionality of a Wire-Pipelined Circuit Design Automation Conference (DAC)
A New Approach to Latency Insensitive Design Design Automation Conference (DAC)
Analog Placement Based on Novel Symmetry-Island Formulation (27.4) Design Automation Conference (DAC)
Constraint-Driven Floorplan Repair Design Automation Conference (DAC)
Early Chip Sizing Carries High Financial and Technical Implications Toshiba America Electronic Components, Inc. (TAEC)
Efficient Power/Ground Network Analysis for Power Integrity-Driven Design Methodology Design Automation Conference (DAC)
Floorplanning Optimization with Trajectory Piecewise-Linear Model for Pipelined Interconnects Design Automation Conference (DAC)
Improving Voltage Assignment by Outlier Detection and Incremental Placement (27.3) Design Automation Conference (DAC)
Modeling Repeaters Explicitly within Analytical Placement Design Automation Conference (DAC)
MP-trees: A Packing-Based Macro Placement Algorithm for Mixed-Size Designs (27.1) Design Automation Conference (DAC)
Multi-Core Design Automation Challenges (42.4) Design Automation Conference (DAC)
Novel Full-Chip Gridless Routing Considering Double-Via Insertion Design Automation Conference (DAC)
Optimal Cell Flipping in Placement and Floorplanning Design Automation Conference (DAC)
Placement of Digital Microfluidic Biochips Using the T-tree Formulation Design Automation Conference (DAC)
Post-Layout Logic Optimization of Domino Circuits Design Automation Conference (DAC)
Pre-Layout Wire Length and Congestion Estimation Design Automation Conference (DAC)
Profile-Guided Microarchitectural Floorplanning for Deep Submicron Processor Design Design Automation Conference (DAC)
SUNMAP: A Tool for Automatic Topology Selection and Generation for NoCs Design Automation Conference (DAC)
Timing Closure for Low-FO4 Microprocessor Design Design Automation Conference (DAC)
Timing-Driven Steiner Trees are (Practically) Free Design Automation Conference (DAC)

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