April 6, 2004 -- Microsoft and Taiwan Semiconductor Manufacturing Company (TSMC) have reached an agreement for TSMC to provide semiconductor manufacturing services for Microsoft's future Xbox products. The agreement expands an ongoing relationship between the two companies by providing Microsoft with direct, collaborative access to TSMC's advanced semiconductor process technologies.
"TSMC has consistently demonstrated industry leadership in the development and deployment of highly advanced semiconductor process technologies for high-volume manufacturing," said Todd Holmdahl, Xbox General Manager of Microsoft Corporation. "It was this solid record of achievement that led us to work directly with TSMC on semiconductors targeted to our future game consoles products."
"Microsoft's future Xbox products and services will require leading-edge semiconductor technologies," said Dr. Rick Tsai, president of TSMC. "This agreement underscores the importance of a partnership between the two companies to identify the best technology platforms for Microsoft's future products."
TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry industry's largest portfolio of process-proven library, IP, design tools and reference flows. The company operates one advanced 300mm wafer fab, five eight-inch fabs and one six-inch wafer fab. TSMC also has substantial capacity commitments at venture fab SSMC and at its wholly-owned subsidiary, WaferTech. TSMC's Nexsys Technology for SoC describes a suite of semiconductor process technologies and foundry services used in advanced technology semiconductor manufacturing.
Go to the TSMC (Taiwan Semiconductor Manufacturing Company) website to find additional information.
