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 Category: News: News Archive 2006: Friday, April 25, 2014
National Semiconductor Launches New Generation of Ultra-Miniature, High Pin-Count Integrated Circuit Packages  
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January 9, 2006 -- National Semiconductor Corp. has announced the release of the micro SMDxt (micro Surface Mount Device extended technology) chip package, the company's newest generation of wafer-level package technologies. In separate announcements, National launched two new Boomer audio amplifiers - the first products that use micro SMDxt packages to reduce board space by as much as 70 percent.

The new package, which builds on National's micro SMD, uses a unique structure that enables high-reliability products with bump counts of 42 to 100 bumps at a 0.5-mm pitch without any underfill. Higher bump-count packages enable designers to create more complex products with advanced features and pack them into a smaller space. (First-generation micro SMD products featured packages with bump counts up to 36 and pitch of 0.5mm.)

The superior electrical noise performance of this package (compared to standard wire-bonded devices) makes it well-suited for high-performance mobile applications. Thermal performance of micro SMDxt packages is comparable to other thermally enhanced packages such as QFN or Leadless Lead Frame (LLP) packages with similar pin count. Reliability standards such as thermal cycling, thermal shock, and drop test, and flex test can be met without the use of an underfill.

The first product that uses the innovative package is the LM4934 Boomer stereo audio subsystem in the 42-bump micro SMDxt. National also introduced the LM4935, a new complete Boomer audio subsystem with a mono Class D speaker driver. Packaged in a 49-bump micro SMDxt, the new LM4935 requires 70 percent less board space than existing solutions.



Go to the National Semiconductor Corp. website for details.

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Keywords: National Semiconductor, micro SMDxt (micro Surface Mount Device extended technology), packages, packaging,
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