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 Category: Special Topics: Transaction Level Modeling: Friday, September 10, 2010
 Transaction Level Modeling (TLM)

Featured Articles

Protocol Abstraction Views Simplify Chip Interconnect Debugging

Imagine you just started to figure out part of a great mystery novel. You flip back a few pages to reconfirm a particular detail. Then, you leaf forward to find another clue, and suddenly…you’ve lost your place in the book. Imagine the mystery novel is about 100 times longer than War and Peace. This is what it’s like to replicate traditional debug methods for many of today’s complex communication protocols.

Anyone who has ever had to debug any type of pipelined design has suffered through this painstaking process. So you try to be really clever with multiple cursors in the waveform window. Then you carefully craft debug messages for fast regex matching in the log. But, eventually, you succumb to the cruel realization that a piece of scratch paper next to your computer is really the quickest way. Now throw in something like "out of order execution" and you start feeling dangerous urges to use dry erase markers on your computer screen. There must be a better way, right?

Somewhere along the way, someone took a step back and realized that we could separate the information being passed (e.g., address, data, and control) from the implementation details (i.e., pin wiggles). Transaction-level modeling (TLM) was born. TLM techniques are very common now for both modeling and verification, and, these days, most decent waveform viewers have some level of transaction viewing built-in.

Read the entire article from Mentor Graphics Corp. on SOCcentral.

Why We Need Standards for Transaction-Level Modeling

Transaction-level modeling has been touted to considerably improve productivity in system-on-chip design. Recently, many popular SOC development environments have been flavored with the spirit of TLM, typically based on the favorite design language for TLM, which seems to be SystemC. Indeed, TLM fabrics for SystemC spring up like mushrooms in the EDA community. The promise is that with transaction-level prototypes, buses and networks-on-chip (NoC) can be simulated magnitudes faster than with RTL models, while achieving almost the same accuracy of simulation results — and all this early in the design cycle where decisions made on these results have the biggest impact. But, does TLM live up to the hype?

To stand a chance, TLM engineers need to hit the ground running – they need their models to work fast. The common goal for the fabrics that are being offered is to ease the construction of model-to-model communication. The communication mechanism is seen as being relatively complex, common to many models, and above all, if it were common, then re-use of models might be possible. The key word is “interoperability.”

TLM designers are spoilt for choice. Reviews of TLM fabrics reveal a diversity of opinions about what a TLM fabric should look like, and each TLM fabric boasts another set of features and limitations. In an attempt to get a general idea of the status quo in transaction-level modeling, we consider three main aspects of TLM fabrics:
  1. The API (“User View”).
  2. Supported levels of communication abstraction (“TLM View”).
  3. The techniques used for the implementation (“Technical View”).

Read the entire article from GreenSocs on SOCcentral.

Using SystemC Reference Models in SystemVerilog Testbenches

System-on-chip (SOC) verification has become more complex than ever as applications converge to offer more features for consumer products. This new level of complexity is presenting SOC development teams with many challenges including verifying their designs in a mixed-language and mixed-abstraction level environment while meeting compressed schedules. Two languages in particular are increasingly popular for SOC development: IEEE Std 1800 SystemVerilog with its advanced verification, modeling and hardware design capabilities; and IEEE Std 1666 SystemC, with powerful modeling features and tight links to the C/C++ programming languages. The challenge faced by many SOC teams is how to use these languages together for mixed-language, mixed-abstraction level verification.

Mixed abstractions come from the fact that designers often develop models at the transaction level to capture the correct architecture and analyze the system performance fairly early in the design cycle. Various components of an SOC developed with high level languages such as C, C++, SystemC, and SystemVerilog are increasingly in demand and for obvious reasons. They are faster to write and faster to simulate. These components are also known as high level reference models. Typically, they are used to capture design specifications early in the design cycle, and then refined to lower levels of abstraction required for synthesis. High level reference models became increasingly important in verifying the implementation details at the RTL level.

Mixed-language environments using SystemC and SystemVerilog are becoming more common due to the growing complexity of the verification challenge and the growing size of verification teams. Both languages are positioned to address the need to abstract the communication behavior and separate communication from control, hence, creating a true IP re-use environment for speeding up designs. SystemC and SystemVerilog are both suitable for writing efficient transaction level models. The use of either language depends heavily on the engineer’s background and expertise.

Typically, engineers with C/C++ expertise use SystemC for its natural extension to C++. The majority of these engineers would be the system architects and analysts. On the other hand, engineers with RTL and verification background tend to use SystemVerilog for its natural extension to Verilog. One common scenario is for SystemVerilog to be used for creating the overall verification environment, while SystemC is used for high-level reference models. This paper explores techniques for integrate a SystemC reference models into SystemVerilog verification environments.

Read the entire article from Synopsys, Inc. on SOCcentral.

Transaction-Level Modeling: SystemC and/or SystemVerilog

Today’s chip design requires extensive system-level simulations to ensure that the right architectural trade-offs are made. In most cases these simulations require that a substantial amount of software is executed on the simulation model of the chip to cover the required functionality. To perform these simulations with adequate performance, design architects increasingly leverage abstract, transaction-level models instead of RTL models to perform such analysis. This article takes a practical view of transaction-level modeling. It looks at two well-accepted design languages, SystemC and SystemVerilog, and explores how they support the concepts of TLM. It further explores how today’s verification tools can leverage the strengths of each language, and shows how a well-engineered transaction-level (TL) interface between SystemC and SystemVerilog offers a modeling solution today that can accelerate the adoption of TLM by providing portability and interoperability of TL models.

Read the entire article from Synopsys, Inc. on SOCcentral.

Advancing Transaction Level Modeling: Linking the OSCI and OCP-IP Worlds at the Transaction Level

The convergence of communications and multimedia data processing onto a single chip continues to push SoC complexity in two areas, SoC integration and software development. To address SoC integration issues, the industry has been moving towards standardizing the IP core interfaces to achieve high reuse. To address software development, the industry has been adopting higher abstraction simulation models which can deliver near enough performance and accuracy to enable software development to begin in parallel with chip development. While OSCI (Open SystemC Initiative) has focused on the software development concerns, and OCP-IP (Open Core Protocol – International Partnership) has focused on SoC integration concerns, the concept of Transaction Level Modeling (TLM) would most benefit from a methodology such that both standards can be utilized in a straight forward manner.

Using CoWare's ConvergenSC and Sonics' SMART interconnects, the two companies have designed such a common methodology which achieves the unified TLM goal. In this article, each TLM standard is discussed, followed by the interoperability work conducted between CoWare and Sonics.

Read the entire article from Sonics, Inc. on SOCcentral.

Rapid SoC Hardware/Software Co-Development Using Transaction Level Modeling

According to the market research company, International Business Strategies (IBS), the semiconductor vendors' system-on-chip (SoC) embedded software development effort has grown in absolute terms by more than 4x from the 250nm process node to the 90nm processes node, and now constitutes about 56% of the total SoC design effort. This growth in effort has proceeded despite the extensive re-use of legacy software intellectual property (IP), and demonstrates the extent to which new software IP must be developed to deliver the requisite SoC functionality.

This growth in effort threatens to adversely affect both the economics and the timely delivery of advanced SoC design. The design methodologies developed for earlier SoC technology are inadequate to the task of designing a multiprocessor SoC. Transaction level modeling (TLM) methodology has been devised to solve these problems. To understand how, we must first examine the major SoC design tasks to be performed before hardware implementation.

Read the entire article from CoWare, Inc. on SOCcentral.

Designer's Mall

SOCcentral news items about Transaction Level Modeling

OCP-IP Delivers Transaction Generator Package (8/25/2010)
OCP-IP Provides Virtual Platform Leveraging Advanced OCP SystemC TLM Modeling Kit (8/25/2010)
Hitachi Achieves 10,000X Performance Boost Using Cadence Technology to Verify Complex Design (7/19/2010)
Hitachi Raises System-Level Simulation Performance 100X with Cadence Palladium Transaction-Based Acceleration (7/19/2010)
Casio Cuts Design Cycle Time and Improves Quality Using Cadence Front-End Technologies (7/16/2010)
Aldec Supports OVM and UVM in Riviera-PRO (6/21/2010)
ARM Accelerates Software Development on Hardware Assisted Verification Systems with VSTREAM (6/14/2010)
Cadence Delivers TLM-Driven Design and Verification, 3D-IC Design and Integrated DFM Capabilities to TSMC Reference Flow 11.0 (6/14/2010)
CoFluent Design and DOCEA Power Collaborate to Accelerate Power Exploration for Systems Optimization (6/11/2010)
EVE’s ZeBu Emulation System Adopted by STMicroelectronics (6/7/2010)
EVE Adds Support for TLM-2.0 to ZeBu Hardware-Assisted Verification Platforms (6/2/2010)
CoFluent Design Adds Embedded C Code Generation to Its UML and systemC-Based Modeling and Simulation Toolset (6/1/2010)
Mentor Graphics Veloce Delivers 400X Acceleration for OVM Driven Verification (5/7/2010)
CoFluent Design Joins the Mathworks Connections Program (4/19/2010)
STMicroelectronics Adopts Mentor Graphics Veloce Emulation Platform for Its New Generation of Set-Top-Box Chip Sets (4/15/2010)
Imperas and OVP Initiative Release Full Support for MIPS Technologies' MIPS32 M14K Processors (4/1/2010)
Mentor Graphics and Platform Computing Optimize Use of Veloce Emulation Systems as Shared Resources (3/30/2010)
OVP Releases Vendor-Verified High Performance Models of Virage Logic's ARC Processors (3/23/2010)
Carbon Unveils New Generation of ARM Models with Availability of Mali Models (3/8/2010)
CoWare Unveils Next-Generation, System-Centric Analysis for CoWare Platform Architect and CoWare Virtual Platform (3/1/2010)
European SystemC User Group Meeting Co-Located with DATE 2010 (2/25/2010)
OVP Releases High-Performance Models of NEC Processors (2/22/2010)
OVP Releases Reference Virtual Platform of ARM Model Running Linux Under SystemC/ TLM-2.0 (2/22/2010)
OCP-IP Delivers More OSCI TLM 2.0 Compatibility in Advanced SystemC TLM Kit (2/1/2010)
Mentor Graphics Catapult C Adds SystemC Synthesis and Expands Full-Chip Capabilities (1/25/2010)
Synopsys Introduces SystemC TLM-2.0 SuperSpeed USB 3.0 Models (1/12/2010)
Top EDA Companies Endorse Tensilica's Pin-Level SystemC Models (12/7/2009)
Technical Presentations from North American SystemC Users Group Meeting Now Online (11/13/2009)
Cadence Extends Its TLM-Driven Design and Verification Solution to Support Leading Embedded Software Environments (10/7/2009)

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Magazine & Journal articles on Transaction Level Modeling

Transaction Analysis and Debug Across Language Boundaries and Between Abstraction Levels Design & Reuse (8/16/2010)
Realizing ESL with Scalable Transaction-Level Models SOCcentral (5/3/2010)
Verification of a USB 3.0 Device IP Core in Multi-Layer SystemC Verification Environment Design & Reuse (3/15/2010)
A Look at ESL SOCcentral (3/11/2010)
Methodology for Rapid Development of Loosely Timed and Approximately Timed TLM Peripherals Design & Reuse (1/21/2010)
Adding Hardware Acceleration to the HVL Testbench Design & Reuse (10/29/2009)
Protocol Abstraction Views Simplify Chip Interconnect Debugging SOCcentral (9/7/2009)
Timing Annotation of Untimed Functional Models for Architecture Use-Case Design & Reuse (8/27/2009)
Bridging from ESL Models to Implementation Via High-level Hardware Synthesis EDA Tech Forum (7/15/2009)
Using TLM Virtual System Prototype for Hardware and Software Validation EDA Tech Forum (7/15/2009)
Troubleshooting a Transaction-Level Model EDN Magazine (6/11/2009)
Doing ESL System Validation Using Transactors Embedded Systems Design (embedded.com) (1/13/2009)
TLM 2.0 Promising, But Interoperability Isn’t Proven SCDsource (11/13/2008)
A SystemC/TLM Based Methodology for IP Development and FPGA Prototyping EDA DesignLine (11/3/2008)
ESL Is Finally Ready for Prime Time SOCcentral (5/12/2008)
Standardization Opens Virtual Platforms to Mainstream Use SOCcentral (5/12/2008)
Regression Test for OCP SystemC Channel Models EDA DesignLine (9/4/2007)
Why We Need Standards for Transaction-Level Modeling SOCcentral (4/9/2007)
Using SystemC Reference Models in SystemVerilog Testbenches SOCcentral (4/2/2007)
Defining the TLM-to-RTL Design Flow EDA DesignLine (1/15/2007)
Transaction-level Debug in SystemVerilog Environment: the Best of Both Worlds SOCcentral (7/3/2006)
Applying Transaction-Level Models for Design and Testbenches SOCcentral (6/5/2006)
A Bridging Model for ESL Synthesis eeDesign (EE Times EDA News) (5/29/2006)
Transactions for the Masses SOCcentral (5/22/2006)
Mixed-Abstraction Virtual System Prototypes Close SOC Design Gaps SOCcentral (4/14/2006)
Performance Is a Way to Differentiate SOCcentral (4/14/2006)
Transaction-Level Modeling: SystemC and/or SystemVerilog SOCcentral (3/6/2006)
Using TLM to Speed Verification and Design SOCcentral (3/6/2006)
Preview USB Performance in an SOC Design Using a SystemC Virtual Platform EDN Magazine (2/16/2006)
SoC Designers: Learn the What, Why, and How of Transactions Electronic Design Magazine (6/23/2005)
Advancing Transaction Level Modeling: Linking the OSCI and OCP-IP Worlds at the Transaction Level SOCcentral (4/29/2005)
Rapid SoC Hardware/Software Co-Development Using Transaction Level Modeling SOCcentral (2/1/2005)

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Tutorials, White Papers and Conference Papers on Transaction Level Modeling

An OCP TLM for Architectural Modeling OCP International Partnership (OCP-IP)
Architecture Oriented Performance Optimizations for Bus-Based System-on-Chip Designs Using TLM CoWare, Inc.
DAC 2007 Papers Design Automation Conference (DAC)
Developing Transaction-level Models in SystemC CoWare, Inc.
Extending the Transaction Level Modeling Approach for Fast Communication Architecture Exploration Design Automation Conference (DAC)
GreenBus: A Generic Interconnect Fabric for Transaction Level Modeling Design Automation Conference (DAC)
Heterogeneous MP-SoC: The Solution to Energy-Efficient Signal Processing CoWare, Inc.
Maintaining Consistency Between SystemC and RTL System Designs Design Automation Conference (DAC)
Modeling OCP Interfaces in SystemC: Standards built on top of OSCI’s TLM-2 OCP International Partnership (OCP-IP)
OCP TLM for Architectural Modeling CoWare, Inc.
OSCI TLM2.0 Standard Compliance: Why Bother? JEDA Technologies, Inc.
PANEL: Building a Standard ESL Design and Verification Methodology: Is It Just a Dream? Design Automation Conference (DAC)
PANEL: ESL: Tales from the Trenches Design Automation Conference (DAC)
Retargetable Generation of TLM Bus Interfaces for MP-SoC Platforms CoWare, Inc.
Straightforward IP Integration with IP-XACT RTL-TLM Switching IPsupermarket
System Design for DSP Applications in Transaction Level Modeling Paradigm Design Automation Conference (DAC)
System Level Design: Six Success Stories in Search of an Industry Design Automation Conference (DAC)
System Level Design: SystemC Using Transaction Level Modeling Aldec, Inc.
SystemC Transaction Level Models and RTL Verification Design Automation Conference (DAC)
The Open Verification Methodology (OVM), OVM World
TLM: Crossing Over from Buzz to Adoption (25.1) Design Automation Conference (DAC)
TLM-2.0 in Action: An Example-based Approach to Transaction-Level Modeling and Model Interoperability Open SystemC Initiative (OSCI)
Unified TLM 2.0 Coverage Measurement JEDA Technologies, Inc.
Utilizing SystemC for Design and Verification Mentor Graphics Corp.
Verification Methodologies in a TLM-to-RTL Design Flow (11.3) Design Automation Conference (DAC)

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