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 Category: News: News Archive 2007: Friday, May 24, 2013
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TSMC Announces Multi-layer Mask Service 

December 27, 2007 -- Taiwan Semiconductor Manufacturing Company, Inc. (TSMC) has announced the foundry industry's first multi-layer mask service (MLM) for 90-nm, 80-nm and 65-nm advanced process technologies. MLM service is another mask s ... read more

SMIC and IBM Sign Licensing Agreement 

December 26, 2007 -- The Semiconductor Manufacturing International Corp. (SMIC) and IBM today announced that they have signed an agreement to license IBM's 45-nm bulk CMOS technology to SMIC for 300-mm wafer foundry service. The licensing ... read more

Unicorn Investment Bank Acquires 75% Equity Stake in Open-Silicon 

December 24, 2007 -- Unicorn Investment Bank has announced the investment of $190 million to Acquire a 75% equity stake in Open-Silicon, Inc., a market leader in chip design and outsourced manufacturing services. Unicorn is partnering wit ... read more

Winbond Electronics Signs New License to MOSAID Patent Portfolio 

December 20, 2007 -- MOSAID Technologies, Inc. has signed a seven year, royalty bearing patent portfolio license agreement with Winbond Electronics Corp. Winbond's new agreement begins on January 1, 2008, following expiration of its curre ... read more

STMicroelectronics Introduces Low-Cost Standard-Definition Set-Top Box Decoder Supporting Leading Security Standards and Multiple Codecs 

December 20, 2007 -- STMicroelectronics today announced the STi5202, a new low-cost STB decoder chip intended for standard-definition (SD) terrestrial, cable, satellite and IP (Internet Protocol) TV applications, and for both retail and o ... read more

Sigma Designs Adopts Suite of Magma Software for Complex SOC Designs 

December 20, 2007 -- Magma Design Automation, Inc. and Sigma Designs, Inc. today announced that Sigma Designs is adopting a suite of Magma products, including design implementation, physical verification and circuit simulation, for ... read more

Si2 Announces Five New Members in the DFM Coalition 

December 20, 2007 -- The Silicon Integration Initiative, Inc. (Si2) today announced five new members of the Design-For-Manufacturability Coalition (DFMC). The new members include Infineon, Intel, Mentor Graphics, STARC, and UMC. They join ... read more

Infineon Broadens Availability of Embedded Flash Process 

December 20, 2007 -- Infineon Technologies AB today announced an agreement with IBM to broaden the availability of Infineon's proven, high-volume embedded Flash process. Infineon's 130-nm embedded Flash technology will be licensed to IBM ... read more

Digital Blocks Announces the DB-I2C Controller IP Core 

December 20, 2007 -- Digital Blocks, Inc. has announced the DB-I2C Controller IP Core. The DB-I2C IP Core targets system-on-chip (SOC) ASSP, ASIC, and FPGA designs containing ARM embedded processors and the AMBA 2.0 APB on-chip bus, as we ... read more

Aldec Releases Active-HDL 7.3 and Introduces Multi-Threaded HDL Compilation 

December 20, 2007 -- Aldec, Inc. today released Active-HDL 7.3, which includes multi-threaded HDL compilation, a new waveform viewer and expanded VHDL 2006 construct support. A noticeable performance improvement in VHDL, Verilog and mixed ... read more

Silicon Line Secures Funding to Pursue Fast-Growing Markets for Its Patented PHY Layer Chips 

December 20, 2007 -- Silicon Line GmbH, a German fabless IC company focusing on ultra-low power analog ICs, has secured initial funding in a Series A round led by Belgium based Capital-E and Germany based Munich Venture Partners (MVP). Si ... read more

Advanced Micro Devices Adopts Magma's FineSim Spice Circuit Simulator 

December 19, 2007 -- Magma Design Automation, Inc. announced today that Advanced Micro Devices (AMD) has selected Magma's FineSim Spice as AMD's circuit simulator of choice for critical analog IP. AMD made the decision after a detailed e ... read more

Sanyo Leverages Altera Cyclone II FPGAs to Bring High-End Vehicle Camera Features to Broad Market 

December 19, 2007 -- Altera Corp.'s Cyclone II FPGAs and Nios II embedded processor are being utilized by Sanyo Electric Co. in its CCA-BC200 automotive rear-view backup camera system. The Cyclone II FPGA featuring a Nios II embedded proc ... read more

QuickLogic’s Military-Temperature Configurable Technology Achieves Volume Production 

December 19, 2007 -- QuickLogic Corp. has now achieved volume production of its QL1P1000 in a mil-spec temperature rating. The QL1P1000 is a member of the PolarPro family of programmable solution platforms, containing up to 1 million gat ... read more

Sigma Designs' Media Processor to Power Sharp's AQUOS Line of Blu-ray Disc Players and Recorders 

December 19, 2007 -- Sigma Designs, Inc. today announced that its highly integrated SMP8634 media processor was selected by Sharp Corp. to power its new line of AQUOS Blu-ray disc players and recorders. Sharp’s new products include the BD ... read more

Micrel Launches Small, High Efficiency Dual Synchronous Buck Converter 

December 19, 2007 -- Micrel, Inc. has launched the MIC23250 dual 400-mA 4-MHz PWM synchronous buck step-down converter housed in a tiny 2x2-mm, 10-lead MLF package. This device is ideally suited for portable applications where high effici ... read more

Advanced Knowledge Associates Adds LCD Controller to List of IP Cores 

December 19, 2007 -- Advanced Knowledge Associates read more

Taiwan-based ALi Licenses Power-efficient MIPS32 24KEc Pro Core 

December 19, 2007 -- MIPS Technologies, Inc. announced today that ALi Corp. has licensed the customizable MIPS32 24KEc Pro core for advanced multimedia designs. ALi integrates the power-efficient MIPS-Verified processor into SOCs targetin ... read more

Tensilica Adds Dolby Digital Consumer Encoder and Dolby Digital Compatible Output 5.1-Channel Encoders to Xtensa HiFi 2 Audio Engine Codec Library 

December 18, 2007 -- Tensilica, Inc. has added the Dolby Digital Consumer Encoder (DDCE) and Dolby Digital Compatible Output (DDCO) 5.1-channel encoders to its audio codec library for the Xtensa HiFi 2 Audio Engine, one of the most popula ... read more

Spansion Selects Berkeley Design Automation Analog FastSpice for Multi-Chip-Package Performance Verification 

December 18, 2007 -- Berkeley Design Automation, Inc. today announced that Spansion has selected the company’s Analog FastSpice circuit simulator for full-circuit verification of its multi-chip-package (MCP) devices for high-performance, ... read more




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