| VirtualLogix Announces VLX for Network Infrastructure 2.0 Supporting Intel Core Microarchitecture |
June 18, 2007 -- VirtualLogix, Inc. has announced VLX for Network Infrastructure 2.0. This newest version of VLX for Network Infrastructure offers a host of new features and capabilities, including enhanced availability and increased OS a ... read more |
| Cypress Simplifies High-Brightness LED Intelligent Lighting Designs with New EZ-Color Controller Family |
June 18, 2007 -- Cypress Semiconductor Corp. has introduced a complete design solution for high-brightness (HB) LED intelligent lighting systems that offers ease-of-use and high performance. Cypress's new EZ-Color family of HB LED control ... read more |
| Cambridge Consultants Becomes Authorized Design Center for picoChip's multi-core DSP |
June 18, 2007 -- Cambridge Consultants, Ltd. has become the first authorized design center for picoChip Designs, Ltd.'s picoArray multi-core digital signal processor. picoArray devices incorporate arrays of DSP elements, delivering ... read more |
| Chartered, Tezzaron Team to Deliver Ultra High-speed Memory Solution |
June 18, 2007 -- Chartered Semiconductor Manufacturing, Ltd. and Tezzaron Semiconductor, a specialist in high-speed memory solutions and 3D wafer stacking processes, announced that Chartered is beginning to ramp production of Tezz ... read more |
| Synopsys Acquires ArchPro Design Automation Featured |
June 18, 2007 -- Synopsys, Inc. has acquired ArchPro Design Automation, Inc. ArchPro's technologies enable engineers to address power management challenges in multi-voltage designs from chip architecture to RTL and gate-level desig ... read more |
| Actel’s SmartDesign Functionality Eases System-level Design |
June 18, 2007 -- Actel Corp. has enhanced its Libero Integrated Design Environment (IDE) to further ease the system-level design process when using its FPGAs. With SmartDesign, a new design entry capability that lets users design at a hi ... read more |
| Chipidea Announces Analog IP Foundry |
June 18, 2007 –- Recognizing the need for an open market approach to providing comprehensive analog intellectual property (IP) solutions, Chipidea Microelectronica, SA has announced it has created the Analog IP Foundry to help designers ... read more |
| STMicroelectronics STR910 Microcontrollers Now with Higher Performance and Lower Cost |
June 18, 2007 -- STMicroelectronics has announced the release of a new version of its 32-bit ARM9-based STR910F Flash microcontrollers. Through technology enhancements, the new STR910FA delivers 25% greater system performance at a more co ... read more |
| Kilopass and Data I/O Join Forces to Deliver Affordable SOC Programming Solutions for Mass Production |
June 18, 2007 -- Kilopass Technology, Inc. and Data I/O Corp. have announced a partnership to provide affordable, mass-production programming solutions for all Kilopass XPM (Extra-Permanent Memory) IP products. Working together, Ki ... read more |
| Lattice Semiconductor Announces mITRON RTOS Support for LatticeMico32 Microprocessor |
June 18, 2007 -- Lattice Semiconductor Corp. has validated the operation of the TOPPERS open source implementation of the mITRON 4.0 real-time operating system (RTOS) with its LatticeMico32 32-bit soft microprocessor. This announcement e ... read more |
| NEC Chooses Altera Stratix II GX FPGAs for New ExpEther Interface Technology |
June 18, 2007 -- Altera Corp. announced today that Tokyo-based NEC System Platforms Research Laboratories has selected Altera's transceiver-based Stratix II GX FPGAs and Nios II embedded processor for implementing its new high-speed ExpEt ... read more |
| New eSilicon Hardcore Program Shortens Development Cycles for ARM Core-based Chips |
June 18, 2007 -- eSilicon Corp. has launched the eSilicon HardCore Program, which offers a broad portfolio of pre-hardened ARM processor cores. The program, which will also offer cores from other IP suppliers, provides easy-to-integrate ... read more |
| STATS ChipPAC Announces Stacked Flip Chip Package for Mobile Platforms |
June 18, 2007 -- STATS ChipPAC, Ltd. has announced a new stacked flip chip package which is designed to integrate three key functions of a mobile communication device into a single package. STATS ChipPAC qualified and is ramping to produc ... read more |
| TI DSPs Approved for Dolby TrueHD and Dolby Digital Plus Decoders for Audio/Video Receivers |
June 18, 2007 -- Texas Instruments, Inc.'s Aureus generation of audio digital signal processors (DSPs) has become the first audio/video receiver (AVR) implementation approved for both Dolby TrueHD and Dolby Digital Plus. With AVRs based o ... read more |
| Volvo Trucks and Mentor Graphics Successfully Complete AUTOSAR Project |
June 18, 2007 -- Mentor Graphics Corp. has announced successful results of an AUTOSAR demonstrator project recently completed with Volvo Trucks. AUTOSAR is the standards organization working to create an open standard for automotive engin ... read more |
| Jetstream Algorithms Become NIST Certified and Are Now FIPS 140-2 Ready |
June 18 2007 -- Security silicon IP provider Jetstream Media Technologies announced today that the algorithms of its security IP cores have successfully passed the Cryptographic Algorithm Validation Program (CAVP), a strict governmental t ... read more |
| ARC Acquires Tenison; Establishes Cambridge Engineering Center Featured |
June 18, 2007 -- ARC International has acquired Tenison Technology EDA, Ltd. The acquisition includes fifteen key members of Tenison's engineering team, patents, and products such as the VTOC software suite and IP eXchange technology. The ... read more |
| TI DSCs Bring Performance and Integration for Real-time Acoustic Triangulation in Team SONIA’s Autonomous Underwater Vehicle |
June 18, 2007 -- Team SONIA, comprising students from the École de technologie supérieure (ETS) in Quebec, Canada, have integrated Texas Instruments, Inc.’s TMS320F28x digital signal controller (DSC) technology into their new vehicle, whi ... read more |
| SiP Technology Attracts Interest as a Potential Alternative to SOC Technology |
June 15, 2007 -- Research and Markets has announced the addition of the new Frost & Sullivan Report “Analysis of World Markets and Trends for System-in-Package (SiP)” to its offering. This Frost & Sullivan research service titled "Analys ... read more |
| Samsung Opens Largest Wafer Plant in Austin, Texas |
June 15, 2007 -- Samsung Electronics Co., Ltd. announced the opening of the largest 300-mm NAND flash memory wafer plant in Austin, Texas. The 1.6 million square foot building is one of the largest single semiconductor facilities in the U ... read more |
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