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 Category: News: News Archive 2009: Wednesday, October 26, 2016
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austriamicrosystems Introduces Through-Silicon-Via Technology for 3D Sensor Integration 

May 27, 2009 -- austriamicrosystems AG has announced the availability of its patented Through-Silicon-Via (TSV) technology for foundry customers. With the TSV technology, two 8-inch wafers can be electrically connected. With typical TSV d ... read more

Netronome Adopts Broad Scope of Cadence Technology 

May 27, 2009 -- Cadence Design Systems, Inc. announced today that Netronome Systems, Inc., a supplier of highly programmable semiconductor products used for intelligent flow processing in network and communications devices, has ado ... read more

TriQuint Selects Synopsys' TCAD Sentaurus for Compound Semiconductor Technology Development 

May 27, 2009 -- Synopsys, Inc. today announced that TriQuint Semiconductor, Inc. has adopted Synopsys' TCAD Sentaurus device simulation software to support its research and development of high-frequency and high-power semiconductor device ... read more

Avnet and Xilinx Open Registration for X-fest 2009 

May 27, 2009 -- Avnet Electronics Marketing and Xilinx, Inc. have announced that registration is open for X-fest 2009, a 36-city global technical seminar series offering practical, how-to training for FPGA, DSP and embedded systems ... read more

TSMC Launches Unified Interconnect Modeling Format for Advanced Process Technologies 

May 27, 2009 -- TSMC (Taiwan Semiconductor Manufacturing Company) has unveiled iRCX, an interoperable electronic design automation (EDA) data format, for TSMC 65nm and 40nm technologies.

The iRCX format unifies interconnect modeling ... read more

Synopsys Releases DesignWare SATA IP for New SATA 6-Gbps Data Transfer Rate 

May 27, 2009 -- Synopsys, Inc. has announced the availability of DesignWare SATA AHCI host and device digital controller IP for the latest SATA 6-Gbps data transfer rate as defined in the Serial ATA (SATA) Revision 3.0 specification. This ... read more

Jazz Semiconductor's DIRECT Multiproject Wafer (MPW) Shuttle Program Enables Rapid Design Verification and Faster Time-to-Market 

May 27, 2009 -- Jazz Semiconductor today announced its DIRECT multiproject wafer (MPW) shuttle program offering customers quick and low-cost prototyping with access to high-performance processes. The program provides a vehicle to develop ... read more

Magma Announces Release of Talus 1.1 with Talus COre Technology and New Talus Flow Manager for Enhanced Designer Productivity 

May 27, 2009 -- Magma Design Automation, Inc. today announced the release of Talus 1.1, a new RTL-to-GDSII chip implementation system that delivers the fastest timing closure on the largest and most complex semiconductor designs. Talus 1. ... read more

Netronome's Network Flow Processor Utilizes Denali's Suite of PCI Express 2.0 Products 

May 27, 2009 -- Denali Software, Inc. today announced that Netronome Systems, Inc. has deployed Denali Databahn PCI Express (PCIe) design cores, MMAV and PureSpec verification IP, which support the latest PCIe I/O virtualization (I ... read more

NVIDIA Deploys Magma Talus 1.1 Release Into Production 

May 27, 2009 -- Magma Design Automation, Inc. today announced that NVIDIA Corp. has deployed Magma's Talus 1.1 IC implementation system into full production. Talus 1.1 offers significant improvements in routing, optimization and runtime a ... read more

Richtek Adopts Simucad's Unlimited SmartSpice License to Increase Design Productivity 

May 27, 2009 -- Simucad Design Automation, Inc. announced today that Richtek, an analog/ mixed-signal design house based in Taiwan, has adopted a company worldwide unlimited license for SmartSpice and Verilog-A.

Analog design houses ... read more

Zoran Introduces Advanced SupraHD 787 HDTV Processors to Premium 1080P DTV Manufacturers 

May 27, 2009 -- Zoran Corp.'s advanced SupraHD 787 HDTV processors are now available to qualified DTV manufacturers supplying the premium ATSC digital TV market in the U.S.

The SupraHD 787 processor extends the product family's supp ... read more

Exar Selects Synopsys as Its Leading EDA Partner 

May 26, 2009 -- Synopsys, Inc. today announced that Exar Corp., a provider of analog and mixed-signal solutions for connectivity and power management, has signed an expanded business agreement to establish Synopsys as its leading EDA part ... read more

ARC and Realtek to Extend Reach of ARC Sonic Focus Audio Technology into PCs and Laptops 

May 26, 2009 -- ARC International and Realtek Semiconductor Corp. have agreed to bundle the ARC Sonic Focus suite of audio enrichment software with Realtek codecs shipped to its OEM and ODM customers globally. In return, ARC has o ... read more

Scaleo chip Introduces easyBCU 32-bit Flash Microcontroller Family for Auto Electronics 

May 26, 2009 -- Scaleo chip has launched easyBCU, a highly-integrated 32-bit Flash microcontroller family for automotive body control units (BCUs). This family of products complements the successful Scaleo chip car interior electronic sol ... read more

CEVA and mimoOn to Collaborate on Development of LTE Baseband Solutions 

May 26, 2009 -- CEVA, Inc. and mimoOn GmbH, a leader in software defined radio (SDR) solutions for advanced wireless standards, have announced a collaboration to offer mimoOn's mi!MobilePHY advanced LTE software on CEVA's newest DSP core, ... read more

SMSC Introduces High-Speed USB Interconnect Device (HSIC) for Embedded Applications 

May 26, 2009 -- SMSC has announced the USB4640, a Hub and Flash media card reader combo solution with a High-Speed Inter-Chip (HSIC) interface. The single-package, dual-function USB4640 offers USB port expansion and Flash media card reade ... read more

SiliconXpress Provides One-Stop Design, Fab, Test, and Packaging Services as Newest Tensilica Design Center 

May 26, 2009 -- Tensilica, Inc. today announced that SiliconXpress, Inc. has become its newest authorized design center. SiliconXpress is a fabless chip provider, headquartered in Lubbock, Texas, offering one-stop design, fabricati ... read more

Silicon Results Validate Design-for-e-Beam Methodology at the 65-nm Node 

May 26, 2009 -- The eBeam Initiative, a forum dedicated to the education and promotion of a new design-to-manufacturing approach known as design-for-e-beam (DFEB), today announced that steering group members D2S, Inc., e-Shuttle, Inc. and ... read more

Rambus Unveils New Innovations for Main Memory 

May 26, 2009 -- Rambus, Inc. has unveiled a set of new features that can advance computing main memory beyond current DDR3 data rate limits to 3200Mbps. These features, available for licensing, build on Rambusí include patented and patent ... read more

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