| Silicon Line Extends Its Ultra-Low Power Technology with Ultra-Low-Power SerDes IC |
April 27, 2009 -- Silicon Line GmbH has extended its ultra-low power technology to the serializer/ de-serializer IC (SerDes) market with the release of its new programmable ultra-low power SerDes chip, the SL83000.
The device can ei ... read more |
| Magma Announces Talus Support of Common Power Format |
April 27, 2009 -- Magma Design Automation, Inc. has enhanced the Talus IC implementation system to support the Common Power Format (CPF). With the addition of CPF, Talus becomes the first RTL-to-GDSII flow to support both the CPF and the ... read more |
| New Lattice Processor Power Manager Reduces Cost of Microprocessor Support |
April 27, 2009 -- Lattice Semiconductor Corp. today announced a new member of its Power Manager II family, the ProcessorPM device, a programmable, single chip solution for the reset generation, watchdog timer and voltage-supervision funct ... read more |
| Actel and Avnet Offer Comprehensive Solution for Display Applications |
April 27, 2009 -- Actel Corp. today announced the availability of five free-of-charge reference designs to enable the design and deployment of display applications quickly and effectively. The validated and tested reference designs are im ... read more |
| CoWare and Carbon Announce CoWare Model Library Availability of Implementation-Accurate Models of ARM IP |
April 27, 2009 -- CoWare, Inc. and Carbon Design Systems, Inc. are partnering to deliver implementation-accurate models of ARM IP targeted for CoWare’s SystemC-based design solutions. The models and model kits will include implemen ... read more |
| Xilinx Broadens FPGA Designers' Options with Domain-specific Methodology for Targeted Design Platforms |
April 27, 2009 -- Xilinx, Inc. is now shipping ISE Design Suite 11.1, the first FPGA design solution with fully interoperable domain-specific design flows and user-specific configurations for logic, digital signal processing (DSP), embedd ... read more |
| SpringSoft, UMC Support Custom Chip Design with 65-nm Process Design Kit |
April 27, 2009 -- SpringSoft, Inc. and UMC (United Microelectronics Corp.) have announced immediate availability of the foundry-certified Laker process design kit (PDK) for UMC 65-nm manufacturing technologies. This jointly develop ... read more |
| Texas Instruments Expands Precision Timing Portfolio Highly Integrated Clock Generator Family |
April 23, 2009 -- Texas Instruments, Inc. (TI) has introduced three new precision clock generators that have a crystal input, replacing up to four discrete high-frequency crystal oscillators with a single device. These devices provide a m ... read more |
| Microchip Technology Debuts nanoWatt XLP Microcontrollers |
April 23, 2009 -- Microchip Technology, Inc. has announced its next-generation low-power PIC microcontroller (MCU) families with nanoWatt XLP eXtreme Low Power Technology for sleep currents as low as 20nA. These three new 8- and 16-bit MC ... read more |
| Xilinx Enables China's First HDTV I/O Card from Dayang |
April 22, 2009 -- Xilinx, Inc. today announced that the new Red Bridge III HD Video I/O Card from Dayang Technology Development, Inc., a supplier of broadcast-quality video products, is enabled by the DSP-optimized Xilinx Virtex-5 SXT fam ... read more |
| Jungo Expands USB Collaboration with Synopsys to Include Software Support for SuperSpeed USB 3.0 |
April 23, 2009 -- Jungo Software Technologies announced that its USBware for SuperSpeed USB 3.0 stacks will be integrated with the Synopsys DesignWare SuperSpeed USB IP offering. The result is a complete turnkey solution for silicon manuf ... read more |
| Shanghai Info Micro-electronics Expands SOC Platform with Vivante GPU IP for Mobile Gaming |
April 22, 2009 -- Vivante Corp. announced that Shanghai Info Micro-electronics, a manufacturer of personal media players, digital photo frames and cameras, portable GPS devices, intelligent toys, and mobile computing platforms, has added ... read more |
| Apache Design Solutions Introduces Totem Power and Noise Integrity Platform for Analog and Mixed-Signal Designs |
April 22, 2009 -- Apache Design Solutions, Inc. has announced Totem, an integrated power and noise integrity platform that addresses the challenges associated with global couplings of power/ ground noise, substrate noise, and package/ PCB ... read more |
| ARM and Mindspeed Extend Relationship with Cortex-A9 Processor Agreement |
April 22, 2009 -- ARM and Mindspeed Technologies, Inc. today announced that Mindspeed has licensed the ARM Cortex-A9 MPCore processor for use in its next-generation, high-performance multi-service networking platforms, designed to ... read more |
| Broadcom's Combo Chip and Software Achieve Bluetooth Qualification to Newly Ratified Bluetooth v3.0 + HS Spec |
April 22, 2009 -- Broadcom Corp. today announced that its Bluetooth combo chip technology and associated BTE software have been qualified as compliant with the ratified Bluetooth v3.0 + HS (high-speed) specification. The new standard sign ... read more |
| Cadence and TSMC Introduce Mixed-Signal/ RF Reference Design Kit in 65-nm Process Technology |
April 22, 2009 -- Cadence Design Systems, Inc. and TSMC have announced the introduction of a mixed-signal/ radio frequency reference design kit (MS/RF RDK). Developed with Cadence Virtuoso mixed-signal technology, the kit provides ... read more |
| CircuitSutra Releases STARC Transaction Level Modeling Guide Compliant Demo SystemC Model Set |
April 22, 3009 -- CircuitSutra Technologies Pvt, Ltd. has developed a demo SystemC model set which is completely based on the STARC Transaction Level Modeling Guide, second edition, released in January 2009. The demo models help system de ... read more |
| HDL Design House Announces High-Performance AHB SPI Flash Memory Controller |
April 23, 2009 -- HDL Design House has announced the HIP 3100, a high-performance AHB SPI flash memory controller. HIP 3100 allows flexible, efficient, and high-performance implementation of an SPI memory flash subsystem on the AHB bus.
... read more |
| imec Presents Functional 22-nm SRAM Cells Fabricated Using EUV Technology |
April 22, 2009 -- imec today presented the world's first functional 22-nm CMOS SRAM cells made using EUV lithography. The 0.099µm˛ SRAM cells are made with FinFETs and have both the contact and metal1 layer printed using ASML's full field ... read more |
| Spansion to Pursue Standalone Strategy Focused on Embedded Solutions Market |
April 23, 2009 -- Spansion, Inc. today announced that the company has decided to pursue a standalone strategy focused on the embedded solutions market and intellectual property licensing. As a result, the company plans to pursue strategic ... read more |
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