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 Category: News: News Archive 2009: Friday, May 24, 2013
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Innovasic Semiconductor Announces Availability of Pin-Compatible 80C186XL and 80C188XL Embedded Processors 

July 6, 2009 -- Innovasic Semiconductor, Inc. is shipping engineering samples of the IA186XL and IA188XL. The IA186XL and IA188XL are form-, fit-, and function-compatible with the original Intel 80C186XL and 80C188XL 16-bit high-integrati ... read more

Avnet Technology Solutions Develops Virtual Trade Show to Showcase Embedded Solutions 

July 6, 2009 -- Avnet Technology Solutions has introduced a virtual trade show to spotlight embedded solutions for original equipment manufacturers (OEMs), independent software vendors (ISVs), system builders and system integrators in Nor ... read more

Dolphin Integration Launches BTF Upgrade of Its SESAME Standard Cell Offering 

July 6, 2009 -- Dolphin Integration continues its enhancement of the proprietary RCSL (Reduced Cell Stem Library) with the high density stem HD-BTF for TSMC's 130-nm G processes. HD-BTF incorporates the latest architectural innovations fr ... read more

Tieto Signs Long-Term Agreement to Deploy OneSpin Solutions' Formal Assertion-Based Verification Solution 

July 6, 2009 -- Tieto, an international IT and R&D services company, and OneSpin Solutions GmbH today announced a long-term agreement to deploy OneSpin’s 360 MV formal assertion-based verification (ABV) solution in Tieto’s high-end FPGA-v ... read more

SpringSoft Strengthens Operations in Asia 

July 6, 2009 -- SpringSoft, Inc. today announced the addition of country managers in Japan and China, further strengthening its global operations and adding seasoned management in two key markets. Tomoyuki Kawarai will manage Japanese ope ... read more

Pulsic Granted Patent for Routing According to Current Density Rules 

July 2, 2009 -- Pulsic, Ltd. has been granted US Patent (11383658) for a unique routing innovation incorporated in its physical chip design software. This important patent, titled "Automatic Routing Nets According to Current Density Rules ... read more

Initio Takes ARC License Targeting USB 3.0 and Solid State Disk Controllers 

July 2, 2009 -- Initio Corp. has taken an ARC International 600 license to address the USB 3.0 and solid state drive (SSD) controller market. The ARC 600 will be embedded within USB 3.0 bridge controllers and SSD controllers to pr ... read more

Altair Semiconductor Integrates TurboConcept Turbo-code IP Cores Into LTE Baseband Processor Line 

July 2, 2009 -- Altair Semiconductor today announced that it has successfully integrated the TurboConcept LTE/WiMAX solutions in its LTE FourGee product line. Altair’s FourGee-3100 LTE baseband processor integrates TurboConcepts’ d ... read more

Verification Special Session at DAC 2009 to Discuss Advances in Debugging 

July 1, 2009 -- A panel of EDA industry experts will address recent advances to ease and speed property and design debugging, in a special session at this year’s Design Automation Conference. Debugging of RTL that failed verification is the larg ... read more

DensBits Selects ARC Storage to Silicon for Next-Generation Multi-Bit Per-Cell Flash Technology 

July 1, 2009 -- ARC International announced that DensBits Technologies, Ltd. has taken a license to use a member of the configurable and extendable ARC 600 Storage to Silicon family of cores. The ARC Storage to Silicon engine will be used ... read more

Synopsys MVSIM Adopted for Low-Power Verification of STw8500 Mobile SOC Platform 

July 1, 2009 -- Synopsys, Inc. today announced that ST-Ericsson has adopted Synopsys' MVSIM low power dynamic verification solution for its STw8500 system-on-chip (SOC) platform for the mobile phone market. ST-Ericsson selected MVSIM for ... read more

ANSYS Releases ANSYS Icepak 12.0 Software 

July 1, 2009 -- ANSYS, Inc. today announced the latest release of ANSYS Icepak software, which provides robust and powerful fluid dynamics technology for electronics thermal management. The 12.0 release introduces new solutions for printe ... read more

Peregrine Semiconductor and MagnaChip Complete Final Qualification on UltraCMOS Technology Transfer 

July 1, 2009 -- Peregrine Semiconductor Corp. and MagnaChip Semiconductor, Ltd. announced that the companies have completed the final qualification phase in the process technology transfer of Peregrine’s UltraCMOS SOS (silicon-on-s ... read more

NSCC Launches AVS SD Decoder Optimized for the ARM Cortex-A8 Processor with NEON Technology 

July 1, 2009 -- ARM and the National Source Coding Center (NSCC), a leader in Chinese GB AVS codec industry, today announced that NSCC has successfully developed the first AVS Standard Definition (SD) decoder optimized for the ARM Cortex- ... read more

TSMC Unveils 65-nm Multi-Time Programmable Non-Volatile Memory Technology 

July 2, 2009 -- TSMC (Taiwan Semiconductor Manufacturing Company) today announced the foundry segment’s first functional 65-nm multi-time programmable (MTP) non-volatile memory (NVM) process technology. The technology incorporates process ... read more

Silistix Adds Power Management to Network-on-Chip 

June 30, 2009 -- Silistix, Ltd. today announced CHAINpower, a new extension to its CHAINworks product line addressing the growing need for integrated clock and power management requirements of modern low-power SOCs.

CHAINpower uses ... read more

SMIC Achieves Silicon Success with High Performance 45-nm Process 

June 30, 2009 -- The Semiconductor Manufacturing International Corp. (SMIC) today announced the successful completion of its first 45-nm high-performance GP (generic process with high performance) yield lot.

SMIC’s high-speed, high- ... read more

Virage Logic Expands Presence in India 

June 30, 2009 -- Virage Logic Corp. has expanded its presence in India with the appointment of CoreEL as its sales representative. CoreEL joins a growing global network of sales representatives that complement and expand the reach of Vira ... read more

Micron Introduces New 34-nm High-Density NAND Products 

June 30, 2009 -- Micron Technology, Inc. today announced mass production of new NAND Flash memory products using its 34-nm process technology. Micron’s new 16- and 32-Gbit NAND chips pair large capacity with performance, providing a compe ... read more

Ramtron Announces 8-Mbit Parallel Nonvolatile F-RAM Memory 

June 30, 2009 -- Ramtron International Corp. today announced the availability of its 8-Mbit in a streamlined FBGA package. The FM23MLD16 is an 8-Mbit, 3-V, parallel nonvolatile RAM in a 48-pin Fine-Pitch Ball Grid Array (FBGA) package tha ... read more




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