| MEMS: Think Outside the Chip...at the Package Level by Electronic Products Magazine |
November 1, 2010 -- The packaging for a MEMS device is a critical component of delivering a successful MEMS-based system solution to the market. Our research has found that, for today's typical MEMS-based products, cost of packaging can be 20% t ... read more |
| Precision Op Amps by Microchip Technology, Inc. in Electronic Products Magazine |
November 1, 2010 -- As technological advances continue to drive down the prices of ICs, more and more system designers are opting for higher-precision operational amplifiers. These devices can simplify system design and/or manufacturing by elimi ... read more |
| Energy Debugging In Embedded Applications by Electronic Products Magazine |
November 1, 2010 -- There is an ever-growing number of embedded systems applications where energy saving and efficiency are at the top of developers' priorities. These priorities can be due to government regulations, a requirement to increase ba ... read more |
| 37th Annual Microprocessor Directory: A Universe Explored by Embedded Insights, Inc. in EDN Magazine |
October 7, 2010 -- Even after 37 years of documenting the companies and their processors that target embedded-system applications, the annual EDN Microprocessor/ Microcontroller Directory continues to grow. This directory represents an effort to ... read more |
| Integrating MEMS with DSPs/ Microprocessors by MEMS Industry Group in Electronic Products Magazine |
November 1, 2010 -- MEMS (microelectromechanical systems) can help us to both sense the world around us and to actuate movement based on the information we gather. Motion control in applications such as the Nintendo Wii remote, the Apple iPhone, ... read more |
| Miniaturizing a Tiny World: Multi-Chip Modules by Electronic Products & Technology (EP&T) |
October 29, 2010 -- With traditional chip-fabrication materials reaching the limits of miniaturization, how can we further miniaturize future chips? Traditionally, chips have been designed mostly on the x and y axes (flat), ignoring the z (verti ... read more |
| Application Specific IP: Ensuring Semiconductor IP Quality by Rosetta IP, Ltd. in Design & Reuse |
October 28, 2010 -- One of the major barriers for semiconductor IP commercialization is to provide evidence for an IP's quality. A common approach by IP vendors is to prove the quality of their IP in a test chip. Usually the die contains the IP ... read more |
| Designing Modern USB Audio Systems by Cypress Semiconductor Corp. in EE Times Audio Designline |
October 27, 2010 -- USB audio is a ubiquitous interface supported by all but the most ancient personal computer hardware and operating systems. With its robust connection and data rate, one might believe that delivering high quality audio over t ... read more |
| Restoring the Artistry of Analog Design by Magma Design Automation, Inc. in EE Times EDA Designline |
October 26, 2010 -- The fact is that analog design is the most difficult and detailed kind of electronic design. The scope of variables to be managed, the extreme sensitivities to circuit constraints, and the quality of results required make ana ... read more |
| DSP Options to Accelerate Your DSP+FPGA Design by Altera Corp. in EE Times Signal Processing DesignLine |
October 14, 2010 -- Although signal processing is usually associated with digital signal processors, it is becoming increasingly evident that FPGAs are taking over as the platform of choice in the implementation of high-performance, high-precisi ... read more |
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