| Telairity Selects Magma's FineSim Spice to Accelerate Circuit Simulation of Video Compression ICs |
July 26, 2010 -- Magma Design Automation, Inc. today announced that Telairity Semiconductor, Inc., a supplier of video compression solutions, has adopted the FineSim Spice circuit simulator. Telairity is using FineSim Spice to desi ... read more |
| Improved Workflow Integration for Electromagnetic Simulation of EMC Applications in CST Studio Suite 2011 |
July 26, 2010 -- Computer Simulation Technology (CST) has announced major workflow improvements for EMC simulation with its 3D EM simulation being further enhanced by tighter integration of CST Cable Studio (CST CS) and the CST Microwave ... read more |
| IP Cores Announces IPsec Security Processor IP Core |
July 26, 2010 -- IP Cores, Inc. has announced the first core of its new high-speed IPsec security processor family. The new ISP1 core is a self-contained implementation of the IPsec packet encryption and authentication algorithms as defi ... read more |
| MIPS Technologies Delivers Reference Implementation for Skype on MIPS-Based Devices |
July 26, 2010 -- MIPS Technologies, Inc. has announced that support for the MIPS architecture is included in new SkypeKit developer tools available now from Skype. Through the SkypeKit closed beta program, MIPS Technologies has developed ... read more |
| NetLogic Microsystems Announces Multi-Core Processor Solution Integrating 128 NXCPUs |
July 26, 2010 -- NetLogic Microsystems, Inc. today announced the XLP8128S multi-core communications processor solution that integrates 128 NXCPUs and over 160 programmable processing engines to deliver 160-Gbps throughput and 240 million ... read more |
| Foveon Switches to Galaxy Custom Designer Solution to Accelerate Time-to-Tapeout |
July 26, 2010 -- Synopsys, Inc. today announced that Foveon, Inc., a developer of image sensors and image capture systems, has taped out its newest-generation direct image sensor using Synopsys' Galaxy Custom Designer® solution. The Foveo ... read more |
| Mentor Graphics Collaboration with National Instruments Provides Faster Testbench Development |
July 26, 2010 -- Mentor Graphics Corp. today announced that collaborative efforts with National Instruments Corp. have resulted in a solution that provides test-oriented feedback to design teams at every step of the design process. ... read more |
| MoSys Tapes Out Bandwidth Engine IC for Next-Generation Networking Applications |
July 23, 2010 -- MoSys, Inc. has successfully taped out its Bandwidth Engine IC. This first member of the MoSys Bandwidth Engine family of advanced system solutions will combine MoSys' patented 1T-SRAM high-density embedded memory with it ... read more |
| Pico Computing Accelerates Cracking of NTLM Authentication Protocol by 500X |
July 22, 2010 -- Pico Computing, Inc. has successfully accelerated cracking of the NTLM (NT LAN Manager) authentication protocol, resulting in performance of over 144 billion keys per second using a cluster of 36 Xilinx FPGA devices inst ... read more |
| Fujitsu Adopts Cadence Encounter Conformal ECO Designer |
July 22, 2010 -- Cadence Design Systems, Inc. today announced that Fujitsu, Ltd. has adopted the Cadence Encounter Conformal ECO Designer to cut costs and reduce design time in its engineering change order (ECO) implementation flow. Fujit ... read more |
| SYSGO Announces ELinOS Support of Octeon Plus Multi-core MIPS64 Processors from Cavium Networks |
July 22, 2010 -- SYSGO has announced the availability in its ELinOS product of support for Cavium Networks' Octeon Plus family. The new SYSGO support package combines the high-performance at minimal power levels multi-core platform ... read more |
| RDC Semiconductor Selects Virage Logic's Intelli DDR3 PHY for Next-Generation SOC |
July 22, 2010 -- Virage Logic Corp. today announced that RDC Semiconductor Co., Ltd. of Hsinchu, Taiwan has chosen the Intelli all-digital, correct-by-construction DDR3 PHY+DLL for the next-generation RDC IAD processor platform targeting ... read more |
| VIA Brings Greater Expediency and Versatility to Fanless Embedded PC design |
July 22, 2010 -- VIA Technologies, Inc. today announced device development kits for the VIA AMOS-5000 series, facilitating a more rational design infrastructure for a broad range of application-specific and fanless Em-ITX-based devices.read more |
| SMIC and Virage Logic Extend Partnership to 40-nm LL Process Technology |
July 22, 2010 -- Virage Logic Corp. and the Semiconductor Manufacturing International Corp. (SMIC) today announced the extension of their longstanding partnership to the 40-nm low-leakage (LL) process technology. Building on the su ... read more |
| Fujitsu Selects Cypress's Flexible TrueTouch Touchscreen Solution for New Docomo Prime Series F-04B Mobile Phone |
July 21, 2010 -- Cypress Semiconductor Corp. today announced that Fujitsu, Ltd. has selected Cypress's solution to implement the touchscreen in the separable handset from NTT Docomo, the docomo Prime series F-04B mobile phone. The new pho ... read more |
| CEA-Leti Unveils Low-Power Reconfigurable Multicore Chip for Software-Defined Radio and Cognitive Radio |
July 22, 2010 -- CEA-Leti has developed a digital baseband circuit for software-defined-radio and cognitive-radio applications that features less than 50µs for full reconfiguration and multi-applications support. The MAGALI chip, develope ... read more |
| HDL Design House Announces HVT MX25L VITAL Behavioral Model |
July 22, 2010 -- HDL Design House has announced the HVT MX25L VITAL behavioral model, fully compliant to Macronix MX25L8006E, 8-Mbit CMOS Serial Flash Memory, REV.0.01, Jan 28,2010 specification. The MX25L8006E is a flash memory with stan ... read more |
| Posedge Announces Small, Fast SDIO 3.0 Device Controller |
July 21, 2010 -- Posedge, Inc. has announced the availability of soft IP core that performs Secure Digital IO (SDIO) device functionality. The PE-SDIOD3.0 is highly configurable and is fully compliant with the latest SDIO specification ve ... read more |
| Samsung Mass Producing 2-Gbit Green DDR3 Using 30-nm Technology |
July 21, 2010 -- Samsung Electronics Co., Ltd. has begun mass producing the industry's first 2-Gbit Green DDR3 using 30-nm class process technology.
"We're seeing a sharp rise in demand for DDR3 chips and are meeting that ... read more |
| Aeroflex Gaisler Introduces MIL-STD-1553B IP Core |
July 21, 2010 -- Aeroflex Gaisler AB has announced the availability of a MIL-STD-1553B IP-core. The MIL-STD-1553B IP core includes Bus Controller (BC), Remote Terminal (RT) and Monitor (MT) and configures as either a BC/ RT/ MT or RT only ... read more |
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