| Lowering the Cost of Medical-Imaging R&D by Samplify Systems, Inc. in EDN Magazine |
February 3, 2011 -- A look inside a typical piece of medical-imaging equipment reveals myriad technologies from many engineering disciplines that must collaborate to form a system. For example, developing X-ray scintillators in CT (computerized- ... read more |
| Advances in Energy-Storage Technology Power Wireless Devices by EDN Magazine |
February 3, 2011 -- Going wireless in applications such as sensor nodes or PC peripherals requires not only wireless communication but also an alternative energy source to an ac wall plug. It makes little sense to eliminate wired communication i ... read more |
| Importance of Dynamic Programming for Achieving Hard Breakdown in Anti-Fuse Technology by Novocell Semiconductor, Inc. in Design & Reuse |
February 3, 2011 -- As system-on-chip (SOC) developers continue to look for ways to reduce cost and time-to-market, it is important to consider the different non-volatile memory (NVM) options that add flexibility to their products. Over the last ... read more |
| ESL Anyone? by Open-Silicon, Inc. in EE Times EDA Designline |
February 2, 2011 -- Electronic system level (ESL) methodologies have been available for some time now. Who's using them and what are they doing with them? Let's begin with a broad and simplistic definition of ESL. ESL is ASIC or FPGA design and/ ... read more |
| Using SystemC to Build a System-on-Chip Platform by Texas Instruments, Inc. (TI) in EE Times Embedded |
February 2, 2011 -- As an embedded systems designer, you may find you're working more with hardware design languages and the system-on-chip (SOC). Perhaps you're building boards or systems using components, both of which often now deal with SOCs ... read more |
| Achieving First-Day Multicore SOC Software Success by Carbon Design Systems, Inc. in EE Times Embedded |
February 1, 2011 -- The past few years have seen a dramatic shift in how companies design and market their system-on-chip (SOC) offerings. Designs that used to contain large amounts of home-grown or internal intellectual property (IP) are becom ... read more |
| Top 10 EMC Design Considerations by Cypress Semiconductor Corp. in Electronic Products Magazine |
February 1, 2011 -- With the increasing demand for high-speed circuits, PCB design is becoming significantly more challenging. Along with design of the actual logic on the PCB, engineers have to consider several other aspects that affect the cir ... read more |
| Design Considerations in the Analog Signal Chain: Part 1 by Cypress Semiconductor Corp. in EE Times Planet Analog |
January 30, 2011 -- Signal chains for measurement of analog quantities typically pose the toughest design challenges for engineers. Even a simple signal chain with a resistive sensor and an analog-to-digital data-acquisition system involves mult ... read more |
| 2D Integrated Circuits by DAC Knowledge Center |
January 26, 2011 -- This is an overview of the current state of 3D chips, or, in particular what has become known as 2D chips based on silicon interposer technology using through-silicon vias (TSVs). It is based on the keynotes at the 3D Archite ... read more |
| How to Instrument Your Design with Simple SystemVerilog Assertions by Mentor Graphics Corp. in EE Times EDA Designline |
January 26, 2011 -- Functional coverage, stimulus generation, and run management are the three major interrelated tasks of functional verification today. Among these, functional coverage arguably looms as the most important, largely because cove ... read more |
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