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 Category: News: News Archive 2011: Monday, May 20, 2013
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CEVA-Teaklite-III DSP Receives DTS-HD Master Audio Logo Certification 

January 12, 2011 -- CEVA, Inc. announced today that its CEVA-TeakLite-III DSP core has been awarded DTS-HD Master Audio Logo certification. The certification, achieved using fully optimized software implementations on an actual hardware p ... read more

ARBURG Saves Money and Delivers High Quality with Zuken's CR-5000 CAD Software 

January 12, 2011 -- ARBURG, one of the world's leading injection-molding machine manufacturing specialists for processing plastics, recently chose Zuken, Ltd.'s CR-5000 electronics design software. As a result, ARBURG is alrea ... read more

GrammaTech Releases Latest Version of CodeSonar 

January 12, 2011 -- GrammaTech, Inc. today announced the availability of the latest version of CodeSonar. CodeSonar's compile-time analysis identifies quality and security problems, helping companies to avoid failures in the field. CodeS ... read more

Synopsys Announces Android Operating System Support for DesignWare ARC Processor Cores  Featured

January 12, 2011 -- Synopsys, Inc. today announced Android operating system (v2.2 FroYo) support for the DesignWare ARC 750D processor core. The DesignWare ARC 750D host processor, which runs at 1.1GHz and delivers 1800DMIPs in an industr ... read more

CEVA Announces Availability of Dolby HD Audio Codec Suite for CEVA-TeakLite-III DSP 

January 12, 2011 -- CEVA, Inc. announced today the availability of a Dolby high-definition (HD) audio codec suite, including 7.1-channel Dolby TrueHD, Dolby Digital Plus, Dolby Pro Logic IIx and Dolby Digital encoder for the CEVA-TeakLi ... read more

TowerJazz and Agilent Technologies Expand High-Speed and High-Power SiGe Design Kit Offering for Agilent's Advanced Design System Software 

January 12, 2011 -- TowerJazz has announced the availability of additional SiGe process design kits (PDKs) for TowerJazz's 0.18-µm SiGe process platform. The design kits target high-frequency products for optical networks, automotive rada ... read more

Global SOC Market to Reach $39.4 Billion by 2015 

January 11, 2011 -- Global Industry Analysts, Inc. announces the release of a comprehensive global report on system-on-chip (SOC). Although the prolonged severity of the recent economic slowdown, and depressed key end-use segments have el ... read more

Praesum Communications Introduces Serial RapidIO 2.1 Endpoint IP 

January 13, 2011 -- Praesum Communications, Inc. has announced general availability of its Serial RapidIO 2.1 Endpoint Core. Early-access customers have been deploying the 2.1 core for more than a year and Praesum is now offering the core ... read more

GlobalFoundries Unveils 28-nm Sign-Off-Ready Digital Design Flows 

January 13, 2011 -- GlobalFoundries today introduced the industry's first 28-nm silicon-validated sign-off-ready digital design flows. Developed in collaboration with EDA/IP ecosystem leaders and based on GlobalFoundries' 28-nm Super Low ... read more

IBM and Samsung Announce Joint Research into New Semiconductor Technology 

January 12, 2011 -- IBM Corp. and Samsung Electronics Co. Ltd. today announced they will collaborate on basic research into new semiconductor materials, manufacturing processes and other technologies. The agreement calls for the tw ... read more

IDT Demonstrates First Touch-Over-AUX DisplayPort-Based Touch Screen Technology 

January 12, 2011 -- Integrated Device Technology, Inc.(IDT) today announced that it has demonstrated the first use of the DisplayPort auxiliary (AUX) channel to carry touch screen data. The demonstration implements a novel technique for ... read more

CEVA's New DSP Core Delivers Highest Audio Performance, User Flexibility and Broad Codec Support 

January 12, 2011 -- CEVA, Inc. today announced the latest addition to its CEVA-TeakLite-III DSP architecture. The CEVA-TL3211 is an advanced DSP targeting the growing needs of low-cost smartphones and high-definition (HD) audio features w ... read more

Jasper Opens Israel R&D Center 

January 11, 2011-- Jasper Design Automation today announced the opening of its fourth international R&D Center in Haifa, Israel. Jasper also has R&D Centers in Belo Horizonte, Brazil; Goteborg, Sweden; and at its headquarters in Mountain ... read more

SMSC to Acquire Conexant Systems 

January 10, 2011 -- SMSC and Conexant Systems, Inc. today announced the signing of a definitive agreement under which SMSC will purchase all of the outstanding shares of Conexant in a stock and cash transaction valued at approximat ... read more

Seven New Pre-Engineered Prototype-Ready Accessories Released for S2C's Rapid SOC Prototyping Solution 

January 10, 2011 -- S2C, Inc. announced the addition of seven new "prototype ready" accessories to its growing library of pre-engineered hardware and software components aimed at speeding the development of SOC prototypes. These modules ... read more

TI's New Piccolo MCUs Provide Optimized Performance and Power Line Communications Capabilities 

January 11, 2011 -- Bridging the gap between low-cost Piccolo and high-performance Delfino floating-point microcontrollers (MCUs), Texas Instruments, Inc. (TI) today announced its new low-cost TMS320F2806x Piccolo floating-point MCUs. The ... read more

Mazda Adopts Synopsys' Virtual Prototyping Solution for Electronic Control Unit Verification 

January 11, 2011 -- Synopsys, Inc. today announced that Mazda Motor Corp. has adopted Synopsys' CoMET-METeor virtual prototyping solution to verify its Electronic Control Units (ECUs). Over the last year, Mazda has been using the METeor ... read more

Legend Design Technology to Represent IP Cores in Taiwan 

January 11, 2011 -- IP Cores, Inc. and Legend Design Technology, Inc., a California company with a branch in Taiwan, have entered into a representation agreement that provides for Legend Design to handle the entire line of products ... read more

Faraday Announces High-Performance IQ ADC and DAC IP Solutions for Wireless Communications in 55nm 

January 10, 2011 -- Faraday Technology Corp. today announced its 55-nm 12-bit 80-MSPS IQ analog-to-digital converter (ADC) and IQ digital-to-analog converter (DAC) IPs. These IPs have been silicon-proven, targeted at the baseband-RF inter ... read more

Zilog Releases 16-Bit MCU SOC for Motor Control Applications 

January 11, 2011 -- Zilog, Inc., a subsidiary of IXYS Corp., has introduced its motor control product, the Z16FMC Series MCU. The Z16FMC, a part of the Flash Motor Control family of devices, is a that boasts an architecture that provides ... read more




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