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 Category: News: News Archive 2011: Tuesday, May 21, 2013
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UMC Delivers High-Endurance, Variable-Voltage-Range Embedded EEPROM Solution 

September 5, 2011 -- UMC (United Microelectronics Corp.) announced that the company has achieved breakthroughs in its development of embedded electrically erasable programmable read-only memory (eEEPROM) solutions, delivering an I/O volta ... read more

DSP Group Announces Availability XpandR III Reference Design for Connected Multimedia Terminals 

September 5, 2011 -- DSP Group, Inc. has announced the availability of the first in a series of connected multimedia terminal reference designs based on the XpandR III system-on-chip (SOC). XpandR III is DSP Group's multimedia chipset sol ... read more

Nufront Selects CEVA DSP Core for Wireless Baseband Chipsets 

September 5, 2011 -- CEVA, Inc. announced that Nufront, a Chinese hi-tech company has licensed CEVA DSP core technology to power its wireless chipset design for handsets targeting developing markets. By leveraging CEVA's DSP engine, Nufro ... read more

GlobalFoundries and Samsung Extend Fab Sync to New High-Performance 28-nm Technology for Mobile Applications 

September 5, 2011-- GlobalFoundries and Samsung Electronics, Co., Ltd. have broadened their collaboration, announcing plans to synchronize global semiconductor fabrication facilities to produce chips based on a new high-performance ... read more

CSR and Zoran Combine 

September 5, 2011 -- CSR, plc. and Zoran Corp. have completed their merger to create a global leader in wireless connectivity, location-aware, imaging, video, and audio products.

"This merger brings together CSR' ... read more

Synopsys and Achronix Announce Multi-Year Renewal of Synthesis Partnership 

September 5, 2011 -- Synopsys, Inc. and Achronix Semiconductor Corp. have announced a multi-year extension of their OEM agreement for Synopsys FPGA synthesis tools. The agreement continues to make Synopsys' FPGA logic s ... read more

Avnet Electronics Marketing Adds Embedded Software from Micrium to Americas Offering 

September 5, 2011 -- Avnet Electronics Marketing Americas has added Micrium, Inc. a low-cost, real-time operating system (RTOS) embedded software developer, to its Americas offering.

Embedded engineers looking to b ... read more

TI Introduces $1.95 DSP and $55 Development Kit 

August 30, 2011 -- Texas Instruments, Inc. (TI) has opened order entry for the new TMS320C553x ultra-low-power DSPs enabling developers to add sophisticated signal processing to consumer audio and voice applications, portable medical equi ... read more

Kawasaki Microelectronics Licenses SNAP to Design Next-Generation, High-Volume Networking Chips 

August 30, 2011-- Sonics, Inc. today announced that K-micro (Kawasaki Microelectronics, Inc.) has licensed the company's SNAP (Sonics Network for AMBA Protocol) solution to help advance its position in the PON (passive optical network), X ... read more

GlobalFoundries Announces Design Enablement Support for 20-nm Design Flows from Leading EDA Vendors 

August 29, 2011 -- GlobalFoundries today announced a significant milestone on the path to market readiness of its 20-nm manufacturing process. By successfully taping out a test chip using flows from leading EDA vendors Cadence Design Syst ... read more

Cadence and GlobalFoundries Speed DFM Sign-Off at 32 and 28nm 

August 29, 2011 -- Cadence Design Systems, Inc. today announced that it has teamed with GlobalFoundries to dramatically reduce the turn-around time for design-for-manufacturing (DFM) sign-off at 28nm. The companies' adv ... read more

Microchip Launches Utility-Band Power-Line Soft-Modem Development Kit 

August 29, 2011 -- Microchip Technology, Inc. today announced a Power-Line Modem (PLM) PICtail Plus Daughter Board Development Kit (AC164145) that is compliant with the utility frequency band and enables products to communicate using the ... read more

Mentor Graphics and GlobalFoundries Improve Yield Analysis with Combination of Tessent and Calibre Capabilities 

August 29, 2011 -- Mentor Graphics Corp. today announced an approach to IC yield analysis that combines the layout-aware production test failure diagnosis capabilities of the Tessent Diagnosis and Tessent YieldInsight products with the de ... read more

Integrand Enables RF IC Design Solution for GlobalFoundries' 55nm-LPe Technology 

August 29, 2011 -- Integrand Software, Inc. today announced the availability of a comprehensive solution for RF IC design on GlobalFoundries' 55-nm-LPe technology. GlobalFoundries' RF solutions flow enables a designer to optimize i ... read more

IAR Systems Delivers Hardware Debug Integration for TI's TMS570 Family 

August 29, 2011 -- IAR Systems AB has announced XDS100v2 emulator debug support for Texas Instruments, Inc.' TMS570 microcontroller family in IAR Embedded Workbench. The XDS100v2 integration enables software applications to be debu ... read more

GlobalFoundries Selects Solido Variation Designer for High-Sigma Monte Carlo and PVT Design in Its AMS Reference Flow 

August 29, 2011 -- Solido Design Automation, Inc. today announced that GlobalFoundries has selected Solido Variation Designer for its analog/ mixed-signal (AMS) reference flow. The Solido products included are the Solido Variation ... read more

GlobalFoundries and Amkor to Collaborate on Advanced Assembly and Test Solutions 

August 29, 2011 -- GlobalFoundries and Amkor Technology, Inc. have entered into a strategic partnership to develop integrated assembly and test solutions for advanced silicon nodes. The companies plan to collaborate to co-develop a ... read more

Dongbu HiTek Launches Specialized High-Performance Analog CMOS and Mixed-Signal BCDMOS Process Technologies 

August 29, 2011 -- Dongbu HiTek Co., Ltd. today announced the immediate availability of two new specialized process technologies at the 180-nm node for implementing advanced analog, power, and mixed-signal chips. While the high-performanc ... read more

Crocus Technology Acquires NXP's MRAM Patent Portfolio 

August 29, 2011 -- Crocus Technology, a developer of magnetic semiconductors, today announced the acquisition of NXP Semiconductors' MRAM patent portfolio. These patents provide fundamental MRAM intellectual property rights in mult ... read more

Idea! Electronic Systems Selects Mixed-Signal IP from S3 Group for Digital TV ASIC 

August 29, 2011S3 Group today announced that Idea! Electronic Systems has licensed its mixed-signal IP for its Digital TV ASIC. S3 Group delivered a high-performance analog-to-digital converter (ADC) from its mixed-signal IP por ... read more




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