| Samsung and Synopsys Collaborate to Achieve First 14-nm FinFET Tape-Out |
December 24, 2012 -- Synopsys, Inc. has announced that its multi-year collaboration with Samsung Electronics Co. Ltd. on FinFET technology has achieved a critical milestone: the successful tape-out of the first test chip on Samsung ... read more |
| Mentor Graphics Announces Comprehensive Design Enablement Platform for Samsung's 14-nm IC-Manufacturing Process |
December 24, 2012 -- Mentor Graphics Corp. has announced comprehensive design, manufacturing, and post tape-out enabling support for Samsung Electronics Co. Ltd.'s 14-nm IC-manufacturing processes, providing a complete design-to-si ... read more |
| ARM and Cadence Tape Out First 14-nm FinFET Test Chip Targeting Samsung Process |
December 24, 2012 -- ARM and Cadence Design Systems, Inc. have announced the tape-out of the first 14-nm test chip implementation of the high-performance ARM Cortex-A7 processor. Designed with a complete Cadence RTL-to-sign-off flo ... read more |
| Samsung Delivers Strong 14-nm FinFET Logic Process and Design Infrastructure for Advanced Mobile SOCs |
December 24, 2012 -- Samsung Electronics Co., Ltd. has reached another milestone in the development of 14-nm FinFET process technology with the tape-out of multiple development vehicles in collaboration with its key design and IP partners ... read more |
| Microsemi Achieves QML Class V and Q Qualifications for RTAX-DSP FPGAs |
December 20, 2012 -- Microsemi SoC Products Group today announced that it has achieved Qualified Manufacturers List (QML) Class V and QML Class Q qualifications for its RTAX-DSP FPGAs.
Microsemi's QML-V FPGAs undergo 2,00 ... read more |
| Mentor Enables Smart Device Development for M2M Applications with Support for Zero Configuration Networking |
December 20, 2012 -- Mentor Graphics Corp. today announced a solution to design network-based devices for machine-to-machine (M2M) and smart-energy applications with the latest release of the Mentor Embedded Nucleus real-time operating sy ... read more |
| Cypress Integrates Ramtron F-RAM Offerings into Its Non-Volatile Memory Portfolio |
December 20, 2012 -- Cypress Semiconductor Corp. today announced that it has integrated Ramtron International Corp.'s ferroelectric random access memory (F-RAM) products into its portfolio, offering the market's widest range of den ... read more |
| Xilinx Vivado Design Suite Now Available in WebPACK Edition |
December 19, 2012 -- Xilinx, Inc. today announced its Vivado Design Suite is now available in WebPACK Edition, giving designers immediate access to a no-cost, device-limited version of an SOC-strength design environment. Offered with the ... read more |
| M31 Technology Joins TSMC IP Alliance |
December 19, 2012 -- M31 Technology Corp. has joined the TSMC IP Alliance. In addition, M31 announced its USB 3.0 PHY (physical layer) IP passed the high- and low-temperature tests and reliability verification for TSMC’s 40-nm process, an ... read more |
| Linley Group Report Estimates Embedded Processor Market Will Exceed $4 Billion in 2015 |
December 19, 2012 -- Estimating that the embedded processor market will top $4 billion in 2015, The Linley Group has released its latest report, "A Guide to Embedded Processors." While citing evidence that this market size is large enough ... read more |
| Atmel to Acquire Ozmo |
December 19, 2012 -- Atmel Corp. today announced that it has entered into a definitive agreement to acquire Ozmo, Inc., a provider of ultra-low power Wi-Fi solutions that will expand Atmel's wireless offerings and further enhance develope ... read more |
| Vivante Shipping Smallest and Lowest-Power OpenGL ES 3.0 IP Core |
December 18, 2012 -- Vivante Corp. today announced the smallest GPU core designed to support the Khronos Group's OpenGL ES 3.0 API based on the GC880 IP leveraging the same ScalarMorphic technology of Vivante's multi-core ultra-threaded G ... read more |
| Blue Pearl Adds Sales and Support Staff in North American |
December 18, 2012 -- Blue Pearl Software, Inc. today announced it has added sales and support staff in North America due to the increased interest in using the Blue Pearl Software Suite for designs in the embedded, military and medical de ... read more |
| HDL Design House MIPI M-PHY and D-PHY Solutions Available in 40nm and 65nm |
December 18, 2012 -- HDL Design House today announced availability of MIPI M-PHY and D-PHY solutions in advanced technology nodes. MIPI M-PHY and D-PHY solutions are fully compliant with the MIPI Alliance M-PHY and D-PHY specifications ve ... read more |
| eASIC and Proton Digital Systems Announce LDPC NAND Flash Read Channel for Enterprise Storage |
December 18, 2012 -- eASIC Corp. and Proton Digital Systems, Inc. today announced the immediate availability of a LDPC (Low-Density Parity Check) NAND Flash read channel for enterprise storage applications. The combination of IP fr ... read more |
| C Plus Selects Berkeley Design Automation Analog FastSpice AMS for High-Speed Mixed-Signal Design Verification |
December 18, 2012 -- Berkeley Design Automation, Inc. today announced that IC Plus Corp., a communication and networking IC design company has selected Berkeley's Analog FastSpice AMS (AFS AMS) for high-speed mixed-signal design ve ... read more |
| Mentor Graphics Nucleus Innovate Program Adds Boards from STMicroelectronics to Accelerate Start-Up Development |
December 18, 2012 -- Mentor Graphics Corp. today announced its Mentor Embedded Nucleus Innovate Program has added board support for STMicroelectronics devices. The Nucleus Innovate Program is designed to help businesses ... read more |
| UMC Achieves Foundry's First 55-nm SDDI Customer Product Tape-Out |
December 18, 2012 -- UMC (United Microelectronics Corp.) has taped out the foundry industry's first customer product utilizing 55-nm small process technology. UMC is now the first foundry to offer a 55-nm version of the process to enable ... read more |
| Agilent Technologies Unveils New IC-CAP Platform for Device Characterization and Modeling |
December 18, 2012 -- Agilent Technologies, Inc. today announced the latest release of its device-modeling software platform, the Integrated Circuit Characterization and Analysis Program (IC-CAP).
With IC-CAP 2013.01, Agil ... read more |
| Sitara ARM Processors Launch Support for Android 4.1.2 Jelly Bean |
December 18, 2012 -- Texas Instruments, Inc. (TI) today announced the availability of a new development kit that brings Android 4.1.2 ("Jelly Bean") to TI's Sitara ARM AM335x Cortex-A8 processors. This complete software offering lets inno ... read more |
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