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 Category: News: News Archive 2012: Thursday, May 23, 2013
Si2 Announces Six New Members of the Open3D Technical Advisory Board  
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May 31, 2012 -- The Silicon Integration Initiative, Inc. (Si2) announced today six additional members of its Open3D Technical Advisory Board (TAB), which is chartered to enable interoperable 2.5D and 3D design flows with open standards, providing common formats and interfaces. The new members of the Open3D TAB are: Altera, AMD, IBM, Helic S.A., SEMATECH, and STARC. There are now 18 companies and organizations participating in the Open3D TAB.

Current working groups for Open3D TAB members include developing standards to support:

  • Definition of the power distribution network across the die of a 3D stack, a topic for which a contribution has already been received in response to the request for technology (RFT) that was released earlier in the year.
  • Thermal design and analysis of an entire 3D stack, including thermal constraints between neighboring dies.
  • Expression of design constraints into and out of the path-finding and floorplanning stage of the overall design process.

"3D implementation presents difficult and complex challenges that will require the development and adoption of standards," said Raj Jammy, SEMATECH&$39;s Vice President of Emerging Technologies. "This partnership aims to fill that space with a complementary effort to enable successful commercialization of 3D ICs."

"The Open3D TAB is making excellent progress and gaining significant momentum, as evidenced by the new members who have recently joined the TAB," said Dr. Sumit DasGupta, Senior Vice President of Engineering, Si2. "Member companies have made key technical donations in areas such as the Chip Interface Protocol description for power-distribution-network analysis from ANSYS and the requirements documents from SRC for power-distribution networks and thermal analysis. We invite others in the industry to join this effort."

At the upcoming Design Automation Conference in San Francisco, Si2 will be presenting a session on "Standards for a 3D World." This will be on June 4 in Room 301 of the Moscone Center from 3:15pm-4:30pm. This session will include a presentation of status of activities in the 3DTAB followed by a panel discussion which will include industry experts who will present some of the issues being addressed now and also cover some of the future challenges.



Go to the Silicon Integration Initiative, Inc. (Si2) website to find additional information.

E-mail Silicon Integration Initiative, Inc. (Si2) for more information.

Read more about
Silicon Integration Initiative, Inc. (Si2)
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Keywords: ASICs, ASIC design, 3D ICs, 3D chips, stacked ICs, FPGAs, field programmable gate arrays, FPGA design, EDA, EDA tools, electronic design automation, Silicon Integration Initiative, Inc. (Si2)
601/38594 5/31/2012 1164 65


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