| Microsemi Expands Military Temperature Semiconductor Portfolio to Include SmartFusion cSoCs | | |
April 11, 2012 -- The Microsemi SoC Products Group today announced its SmartFusion customizable system-on-chip (cSoC) devices are now fully screened to meet stringent military operating temperatures ranging from -55°C to 125°C. The devices feature an integrated ARM Cortex-M3-based processor and are fully tested for operation at military temperature ranges, targeting applications where ensuring high-reliability performance is critical.
"Our mil-temp qualified cSoCs build on our more than 50-year heritage of delivering highly reliable, fully tested solutions for demanding military and avionics applications," said Esam Elashmawi, Vice President and General Manager at Microsemi. "In addition, our SmartFusion cSoCs combine analog and digital functionality on the same die, which allows designers to address SWaP (Size, Weight and Power) and cost concerns."
SmartFusion cSoCs provide military and avionics systems designers with a reprogrammable, non-volatile logic integration solution. The devices are based on secure Flash technology that provides immunity against damaging radiation-induced configuration upsets, while eliminating the need for additional code storage. The reprogrammable cSoCs also enable quick prototyping and design validation capabilities, which streamline product development efforts. Additional benefits include:
- Fully tested ARM Cortex-M3 solution across the complete military temperature range.
- 100% tested across the entire -55°C to 125°C temperature range, ensuring performance specifications are met and eliminating the need to up-screen commercial-of-the-shelf (COTS) devices.
- Live at power up (LAPU), delivering immediate processing to support short initiation systems without the need for additional power circuitry.
- Offered in 500K and 60K equivalent gates and support up to 204 input/outputs (IOs).
- Enables system- and power-management capabilities where multiple power rails exist.
- Lets designers combine analog and digital components, saving board space.
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Availability
Military temperature samples and software will be available in May 2012 for prototyping purposes. Fully qualified parts will be available June 2012. Qualified parts will include the SmartFusion A2F500 FG/G: 484 and 256 packages as well as the A2F060 FG/G 256 package.
Go to the Microsemi SoC Products Group website to find additional information.
| E-mail Microsemi SoC Products Group for more information.
Read more about Microsemi SoC Products Group on SOCcentral.com |
| Keywords: FPGAs, field programmable gate arrays, FPGA design, ARM-based microprocessors, MPUs, IP, intellectual property, cores, Microsemi SoC Products Group, SmartFusion cSoCs
| | 601/38241 4/11/2012 389 74 | |
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