November 24, 2008 -- 3D semiconductor packages enable the form and function for many devices we use in our daily lives--mobile handsets, personal entertainment devices and flash drives, to name a few. For people who rely on such implantable medical devices as insulin pumps or defibrillators, these 3D packages play a critical role in improving quality of life. Functional density, weight and configurability are just a few of many reasons a growing number of semiconductor products are going vertical using stacked-die, package-on-package (PoP) or through-silicon-via (TSV) packages. Each method provides unique benefits. However, targeted design planning, implementation and analysis strategies are required to achieve the full potential of these approaches.
Kevin Rinebold. (Rinebold is a senior product marketing manager at Sigrity, responsible for advanced packaging and design planning products.)
This brief introduction has been excerpted from the original copyrighted article.