May 18, 2011 -- This article outlines recent a new architecture for implementing a communication channel between two highly integrated dice. It shows how the on-chip interconnect can be extended to bridge between chips while retaining high bandwidth and low latency. In addition, the technique allows other signals to be integrated into this communication channel without side band signals in a low pin-count and low power architecture. This arrangement provides a universal link which allows the cooperation of multiple chips within a package which may have been designed independently.
By Andrew Jones and Stuart Ryan. (Jones and Ryan are both with STMicroelectronics R&D, Ltd.)
This brief introduction has been excerpted from the original copyrighted article.