November 21, 2011 -- This article discusses the current state of 3D tools and software, describes a working flow, and identifies the areas where more progress is needed. We base the discussion on a specific next-generation demonstration device taken from a design that Tezzaron is prototyping with several partners. The demo design contains an advanced ARM processor stack, an "off the shelf" FPGA die, and a DRAM memory stack, all assembled onto an active silicon circuit board acting as an interposer.
By Robert Patti. (Patti is CTO and Vice President of Design Engineering of Tezzaron Semiconductor (Singapore) Pte, Ltd.)
This brief introduction has been excerpted from the original copyrighted article.
