January 5, 2012 -- STATS ChipPAC, Ltd. today held the ground-breaking ceremony for a new factory in Singapore. The new 197,000 square foot building will be located next to the company's current factory in Yishun, Singapore and will enable STATS ChipPAC to expand its manufacturing capabilities for advanced wafer-level technologies including embedded wafer level ball grid array (eWLB), wafer level chip scale packaging (WLCSP), integrated passive devices (IPD) and through-silicon via (TSV).

STATS ChipPAC had invested approximately $250 million (US) in Singapore over the last three years to expand its technology offering and manufacturing capacity. The new factory will allow the company to further expand its capacity in advanced wafer-level packaging and test solutions to support growing demand. The Company expects to invest an additional $220 million in Singapore over the next several years.

"We believe our technology leadership, manufacturing capabilities and new capacity in Singapore will provide a strong foundation for future expansion in our advanced wafer-level package offering in eWLB, WLCSP, IPD and TSV. Advanced wafer-level technologies are essential to support our customers' requirements for increased performance and functionality in a smaller footprint for sophisticated mobile devices such as smartphones and tablets," said Tan Lay Koon, President and Chief Executive Officer, STATS ChipPAC.