March 7, 2012 -- STATS ChipPAC, Ltd. has announced its next-generation three-dimensional (3D) embedded Wafer Level Ball Grid Array (eWLB) Package-on-Package (PoP) solutions. This new 3D technology provides an ultra-thin package profile height below 1.0mm, a 30% height reduction over the industry-standard 1.4-mm total stacked-package height.

PoP has been a successful 3D packaging approach by virtue of the flexibility it offers in combining individual memory and logic packages vertically into a single solution in the industry standard 1.4-mm total stacked-package height. While current PoP technologies are effective in integrating multiple functions in a small form factor, reaching the next level of packaging bandwidth and performance in more advanced mobile devices drive advancements in the stacked package profile height below 1.0mm as well as tighter substrate line/ space capability.

STATS ChipPAC's eWLB PoP technology offers significant performance, cost and height advantages over traditional substrate-based PoP technology. By utilizing eWLB's fan-out wafer-level packaging approach, STATS ChipPAC has been able to reduce the bottom PoP package height to less than 0.5mm. eWLB PoP is available in either a single or double-sided configuration and provides a flexible integration platform for stacking a wide range of memory packages on top with a final stacked package height below 1.0mm.