July 2, 2012 -- United Microelectronics Corp. (UMC) has licensed IBM technology to expedite the development of the foundry's next-generation 20-nm CMOS process with FinFET 3D transistors. Under the terms of the agreement, IBM will license its 20-nm process design kit and FinFET technology to UMC so the foundry can use these technologies to accelerate the availability of these processes for UMC customers.
This agreement between UMC and IBM is only inclusive of IBM's 20-nm CMOS and FinFET. UMC's internally developed 20-nm planar process will be aligned to IBM's design rules and process/ device targets, while UMC's FinFET will be offered as a low-power technology enhancement option for mobile computing and communication products. Implementation will take place at the company's Tainan, Taiwan R&D site.