July 3, 2012 -- The EV Group (EVG) today introduced the EVG850TB/DB automated temporary bonding and debonding system built on the company's new XT Frame platform, which has been optimized to support thin-wafer processing for high-volume 3D IC and TSV (through-silicon via) manufacturing. A combination of hardware and software design enhancements enables double the processing throughput over EVG's previous-generation platform to up to 40 stacks per hour.

The new XT Frame-configured EVG850TB/DB is designed for EVG's open materials platform approach, which enables the use of a wide range of adhesives from various materials suppliers. This approach provides the most-flexible choice of bonding materials supporting ZoneBOND and other technologies, and is key to achieving high process throughput, repeatability and yields for 3D IC manufacturing.

"Temporary bonding and debonding of device wafers to wafer carriers for thin-wafer processing are critical steps to enabling the successful integration and implementation of 3D ICs into high-volume production," stated Dr. Thorsten Matthias, Business Development Director, EVG. "To this end, advances in wafer bonding are necessary to support the efforts of early 3D IC/ TSV adopters as they move ever-closer to attaining this goal. Our new XT Frame-configured EVG850TB/DB builds upon our core expertise to provide production-ready solutions for our customers to facilitate their rapid ramps from development and integration to high-volume manufacturing. It is designed from the ground up to enable the highest productivity and yields in thin-wafer processing."

Built on the company's new XT Frame platform, the EVG850TB/DB is capable of accommodating up to nine process modules, doubling the previous maximum processing capability of EVG's temporary bonding and debonding systems. The new XT Frame design enables highly efficient continuous-mode operation (zero idle time) capability via an ultra-fast handling system, up to four FOUP (front-opening unified-pod) load ports, and a material buffer in the form of a local FOUP storage system that holds up to 10 additional FOUPs. The platform also features an in-line metrology module option to enable real-time monitoring of the bonding/ debonding process, enabling maximum yields and helping to lower production costs for thin-wafer processing. In addition, the EVG850TB/DB has been qualified for all bonding and debonding methods, including low-temperature debonding methods such as ZoneBOND technology with EZR (Edge Zone Release) and EZD (Edge Zone Debond) modules.

Availability

The EVG850TB/DB built on the new XT Frame platform is now available for shipping.

Posted by: John Miklosz