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ISQED 2012 Announces Call for Papers   
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August 6, 2012 -- The International Symposium on Quality Electronic Design (ISQED) is accepting paper, panel and speaker proposals, as well as exhibitor and sponsorship applications, for its 14th annual event, March 4-6, 2013, Santa Clara, Calif. To be considered for an ISQED 2013 presentation and for publication by the IEEE, authors are asked to submit papers by Sept. 12, 2012.

ISQED features technical sessions with over one hundred papers on various challenging topics related to design, design automation, design for manufacturability and quality. The Symposium also includes panel discussions, tutorials, and exhibits, with a focus on innovation and quality in electronic design. Authors are invited to submit proposals that address circuit design; high-level design; test and verification; design automation tools; processes; flows, device modeling, semiconductor technology, advance IC packaging, 3D ICs, biomedical and bio-electronic devices.

Posted by: John Miklosz



Go to the ISQED website for details.

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Keywords: ASICs, ASIC design, 3D ICs, 3D chips, stacked ICs, EDA, EDA tools, electronic design automation, verification, electronic system level design, electronic system-level design, ESL, packages, packaging, ISQED
601/38924 8/6/2012 520 85


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